01/05/2016  Rudolph Technologies, Inc., has received an order for over $15 million from a foundry in Asia for multiple NSX 330 Systems.

12/15/2015  The $18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC leadframes, underfill, and copper wire.

12/14/2015  After deflated 2015, 3D leads the way.

12/11/2015  SEMI this week reported that worldwide semiconductor manufacturing equipment billings reached US$9.6 billion in the third quarter of 2015.

12/08/2015  It is possible to fabricate copper pillars more than 100?m in height, with aspect ratios up to 6:1, using advanced packaging stepper lithography in conjunction with electroplating.

12/08/2015  Subtleties in thicknesses between the alternating Cu metal and dielectric layers within a build-up substrate can impact BLR performance.

12/07/2015  CEA-Leti today announced preliminary steps for demonstrating a quantum bit, or qubit, the building block of quantum information, in a process utilizing a silicon-on-insulator (SOI) CMOS platform.

12/07/2015  CEA-Leti today announced it has signed an agreement with Keysight Technologies, a device-modeling software supplier, to adapt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation.

12/07/2015  Market projected to grow by 0.2 percent in 2015, 1.4 percent in 2016, and 3.1 percent in 2017.

12/03/2015  Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020.

12/03/2015  Sales of top 10 IDMs forecast to be flat; top 10 fabless companies expected to slip into negative growth this year.

12/01/2015  GaN Systems, a manufacturer of gallium nitride power transistors, announces that its foundry, Taiwan Semiconductor Manufacturing Corporation (TMSC), has expanded the high volume production of products based on GaN System’s proprietary Island Technology by 10X in response to surging global demand from consumer and enterprise customers.

11/17/2015  Is there any question that TCB is real and will be the next big bonding technology? The focus this month is more on this very important new assembly process from Intel and ASM.

11/13/2015  Worldwide silicon wafer area shipments decreased during the third quarter 2015 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

11/13/2015  The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.

11/12/2015  Method analyzes non-uniform conductors with a magnetic field.

11/03/2015  FEI announced the Helios G4 DualBeam series, which offers the highest throughput ultra-thin TEM lamella preparation for leading-edge semiconductor manufacturing and failure analysis applications.

11/03/2015  DCG Systems announced the release of EBIRCH, a technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits.

11/03/2015  Tsinghua Unigroup Ltd., a Chinese government-owned chipmaker will make a $600 million investment in Powertech Technology of Taiwan, according to multiple reports.

10/30/2015  Ziptronix, Inc. announced it has entered into a development agreement with Fraunhofer IZM-ASSID.