05/14/2015  Semiconductor Research Corporation (SRC) announced today that Ken Hansen has been appointed SRC’s new President and Chief Executive Officer (CEO), effective June 1.

05/12/2015  IBM today announced a significant milestone in the development of silicon photonics technology, which enables silicon chips to use pulses of light instead of electrical signals over wires to move data at rapid speeds and longer distances in future computing systems.

05/06/2015  Interconnecting transistors and other components in the IC, in the package, on the printed circuit board and at the system and global network level, are where the future limitations in performance, power, latency and cost reside.

05/01/2015  Entegris, Inc., a provider of yield-enhancing materials and solutions for advanced manufacturing processes, announced the election of James P. Lederer as an independent director at the Company's Annual Meeting of Shareholders held today.

04/27/2015  The decision came after the U.S. Department of Justice (DoJ) advised the parties that the coordinated remedy proposal submitted to all regulators would not be sufficient to replace the competition lost from the merger

04/22/2015  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.

04/17/2015  Total top 10 marketshare of semiconductor industry now back over 50 percent.

04/16/2015  Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

04/15/2015  A*STAR’s Institute of Microelectronics (IME), together with industry partners, have formed a High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium to extend FOWLP capabilities for applications in devices such as smart phones, tablets, navigation tools and gaming consoles.

04/14/2015  Semiconductor equipment manufacturer ClassOne Technology announced today that it has signed a joint electrochemical deposition (ECD) applications lab agreement with Shanghai Sinyang Semiconductor Materials Co., Ltd.

04/14/2015  On June 18, the SEMI Packaging Tech Seminar will take place in Vila do Conde, Portugal.

04/07/2015  STATS ChipPAC Ltd. announced that Cavendish Kinetics, a provider of high performance RF MEMS tuning solutions for LTE smartphones and wearable devices, has adopted its advanced wafer level packaging technology

04/07/2015  When the commercial semiconductor manufacturing industry decides to move to the next wafer size of 450mm, it will be time to re-consider equipment and facilities strategies.

04/03/2015  Semiconductor equipment manufacturer ClassOne Technology announced the sale and delivery of its Solstice S8 Plating System to Advanced Wireless Semiconductor Company (AWSC) of Taiwan.

04/03/2015  Recent acquisitions expeted to boost Europe's share in coming years.

04/02/2015  Packages are changing. Acoustic methods provide a way to image and analyze them.

04/02/2015  Supplier Hub answers the needs of a changing semiconductor industry.

03/20/2015  A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

03/18/2015  The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.

03/18/2015  Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licensing agreement with Sony Corporation for application in advanced image sensors.