12/16/2014  Amkor Technology, Inc., a provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology.

12/16/2014  The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.

12/12/2014  GSA members identified the Most Respected Public Semiconductor Company Award winners by casting ballots for the industry’s most respected companies for its products, vision and future opportunities.

12/11/2014  Initially focused on the military, uncooled thermal camera sales have grown significantly due to substantial cost reduction of micro bolometers and growing adoption in commercial markets, including thermography, automotive and surveillance applications.

11/18/2014  The materials market will grow from $789M in 2013 to over $2.1B with a CAGR of 18%.

11/06/2014  Chengdu assembly/test facility now in production; site celebrates grand opening

10/30/2014  SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

10/20/2014  IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.

10/17/2014  The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

10/14/2014  India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors.

10/13/2014  A Portland, Oregon jury today delivered a verdict in favor of Mentor Graphics in a patent infringement trial against Synopsys, Inc., awarding Mentor Graphics $35 million in damages and royalties.

10/01/2014  FlipChip International (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.

09/23/2014  NANIUM today announced it has successfully launched the industry’s largest Wafer-Level Chip Scale Package (WLCSP) in volume.

09/09/2014  Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

08/20/2014  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

08/15/2014  MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

08/06/2014  The Facilities 450mm Consortium (F450C), a partnership of leading nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced it has again increased in size, naming Pfeiffer Vacuum as the twelfth member company to join the consortium.

07/24/2014  Recent developments in wafer bonding technology have demonstrated the ability to achieve improved bond alignment accuracy.

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

07/10/2014  Technology innovation isn’t slowing down. But its steady acceleration isn’t happening spontaneously, and Tuesday’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.