01/23/2014  Green is the color for the decade and future decades as each country is developing its own standards for energy consumption and implementing its green initiatives.

01/23/2014  At Semicon Europa, Paul Farrar, general manager of G450C, provided an update on the consortium’s progress in demonstrating 450mm process capability. He said 25 tools will be installed in the Albany cleanroom by the end of 2013, progress has been made on notchless wafers with a 1.5mm edge exclusion zone, they have seen significant progress in wafer quality, and automation and wafer carriers are working.

01/21/2014  Today, at the SEMI European 3D TSV Summit, nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.

01/21/2014  On January 14, 2014, we read on the Investors.com headlines page - Intel Seen Gaining Huge Pricing Advantage Over TSMC. Just three days later comes the responding headline: TSMC: We're "Far Superior" to Intel and Samsung as a Partner Fab.

01/16/2014  ARM and global semiconductor foundry UMC this week announced an agreement to offer the ARM Artisan physical IP platform along with POP IP for UMC’s 28nm high-performance low-power (HLP) process technology.

01/15/2014  The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its $20 billion value through 2017, despite shifts away from the use of precious metals such as gold in wire bonding.

01/15/2014  SEMI today announced that two teams — from the University of Florida and Xilinx — are recipients of the 2013 SEMI Award for North America.

01/14/2014  Macroeconomic and microelectronic industry growth opportunities and innovation challenges underscored diverse perspectives from analysts, economists, technologists, semiconductor manufacturers and supply chain executives speaking at the SEMI Industry Strategy Symposium (ISS) that opened yesterday.

01/14/2014  Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

01/13/2014  Patterning options for N10/N7 nodes, advanced packaging solutions and 3D NAND memory to be targeted.

12/16/2013  3DIC memory, and therefore all of 2.5/3D technology, took one step closer to full commercialization last week with the HBM joint development announcement from AMD and Hynix at the RTI 3D ASIP meeting in Burlingame CA.

12/10/2013  SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.

12/06/2013  GIA invites senior industry executives, domain experts, technologists and market strategists to participate in a comprehensive global research initiative studying the “Thin Films” markets.

12/06/2013  Fab construction projects boom in 2013 but slow in 2014.

11/25/2013  It would seem that if Intel could scale transistor cost as they have done in the last 40 years then they could win these super high volume consumer-oriented designs where cost is extremely important. And TSMC is clearly taking this seriously.

11/21/2013  Foundry 2.0 partnership with Open-Silicon and Amkor Technology yields successful 2.5D test vehicle project.

11/20/2013  SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

11/18/2013  STMicroelectronics and Yogitech, a provider of functional safety solutions, have signed an agreement to create a comprehensive package that will simplify the development and certification of safety-critical applications based on STM32 microcontrollers.

11/12/2013  FlipChip International announced today the 100% acquisition of Millennium Microtech (Shanghai) - (MMS), a provider of fully integrated semiconductor packaging and testing services situated in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China.

10/30/2013  At the recent ECTC conference, various presentations addressed silicon interposers for 2.5D (Shinko), CoWoS reliability (TSMC) and microbumping (imec).