04/02/2013 

GLOBALFOUNDRIES today announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications.

03/20/2013 

Wafers with a diameter of 450mm enable the micro-chip industry an increase in yield of up to 80%. This leads to an enormous increase in productivity. In order to control the product quality, these wafers receive a specific marking from the manufacturer.

03/15/2013 

In 2012, global PCB industry saw a jump in terms of output value, benefitting in a large part from the rapid growth in the shipment of Apple and Samsung. However, there is no such possibility of a huge jump in 2013, as the report states the expected growth rate will slow down to 2.7%.

03/15/2013 

OneChip Photonics this week revealed strategic, outsourcing plans to expand into new markets, with announcements of newly-established relationships with semiconductor foundry GCS and wafer supplier IQE. Both announcements related to OneChip’s bigger, strategic plan to expand its services into the high-volume DCI market.

03/13/2013 

Foundry to use wafers for 3D IC and advanced packaging volume production applications.

03/12/2013 

Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process.

03/12/2013 

Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.

03/07/2013 

LFoundry to manufacture wafers for Aptina following LFoundry’s purchase of Micron’s Avezzano, Italy semiconductor fabrication facility.

03/06/2013  eMemory announced today that the accumulated number of customers’ wafers incorporating eMemory’s eNVM SIPs have now surpassed 5 million production mark.

03/06/2013 

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.

03/05/2013 

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.

03/05/2013 

Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), yesterday announced plans to collaborate with Murata Manufacturing Company on a multisource arrangement for RF switches and other components based on Peregrine’s proprietary UltraCMOS technology

03/04/2013 

Flip-Chip is big on value: in 2012, it was a $20B market, making it the biggest market in the middle-end area, and Yole Développement expects it to continue growing at a 9% clip, ultimately reaching $35 billion by 2018.

02/28/2013 

This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.

02/26/2013 

New marketing and technical support center opened in Reading, UK.

02/21/2013 

At this week’s International Solid State Circuits Conference (ISSCC 2013), imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages.

02/20/2013 

CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.

02/20/2013 

STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.

02/20/2013 

Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.

02/19/2013 

In February, Infineon received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at their site in Villach, Austria.