08/28/2012 

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders.

08/27/2012 

Microsemi says its new die packaging technology, targeting implantable medical devices such as pacemakers and cardiac defibrillators, can be paired with an ultralow-power radio for wireless health monitoring.

08/24/2012 

The U.S. Court of Appeals for the Federal Circuit issued a favorable ruling in Amkor's appeal in its patent infringement case against Carsem and affliates before the U.S. ITC, Amkor reports.

08/21/2012 

Heptagon, wafer-level optics maker, ordered an advanced DWL 2000 maskless lithography system from Heidelberg Instruments. The tool has sophisticated Gray Scale Exposure capability.

08/21/2012 

Tessera received an initial payment of approximately $20 million from semiconductor packaging company Amkor, related to the interim award issued by the International Court of Arbitration of the International Chamber of Commerce (ICC).

08/17/2012 

Deca Technologies, wafer-level packaging (WLP) services to the semiconductor industry, added Iain Meikle as VP of operations and managing director in the Philippines.

08/16/2012 

Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company

08/15/2012 

The MEMS Industry Group (MIG) is planning webinars on micro electro mechanical systems (MEMS) from packaging challenges to how MEMS can benefit healthcare.

08/09/2012 

The field of power electronics, the application of electronics for the control and conversion of electric power, is underpinned by basic electrical principles that were established in the distant past by the pioneers of electrical science. But today, the need to supply, modify and control the voltage, current or frequency of electric power arises in a vast number of applications and products spanning a huge range in terms of power handling capability.

08/09/2012 

Heavy monsoons moving through the Philippines are causing floods in and around Manila, the capital. The Philippines is a small but growing area for microelectronics manufacturing and packaging facilities.

08/08/2012 

Tektronix Component Solutions, a custom microelectronics services provider, tapped supply chain aggregator MOSIS to help its customers develop complete, high-performance ASICs with lower early-stage ASIC development costs.

08/02/2012 

The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.

08/02/2012 

Unisem named Lee Hoong Leong as group COO, replacing Ang Chye Hock, who has retired. Lee brings experience from UTAC, STATS ChipPAC, TI, and National Semiconductor.

08/01/2012 

FlipChip International (FCI), wafer-level packaging and flip chip bumping provider, named Weng Kay Lui as Asian sales director, overseeing sales for, among other areas, FCI's recently expanded FlipChip Millennium (Shanghai).

07/27/2012 

EMCORE, compound semiconductor-based components and subsystems supplier, will replace multiple legacy manufacturing systems in its compound semiconductor fab and back-end packaging operations with the Camstar Enterprise Platform.

07/25/2012 

STATS ChipPAC appointed Gary Tanner as a member to its Board of Directors. Tanner brings experience from Zarlink Semiconductor, Intel, Texas Instruments, and other semiconductor companies.

07/13/2012 

At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.

07/13/2012 

At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.

07/12/2012 

CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.

07/10/2012 

Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.