03/11/2011 

Accel-RF Corporation installed two advanced semiconductor reliability test systems for customers in Taiwan and Japan. The systems were delivered in Q4 2010 with installation completed in early January 2011.

03/10/2011 

Multitest announced that a major fabless semiconductor manufacturer has evaluated and approved its Mercury-based wafer-level contactors for subcontractors in Asia.

03/08/2011 

Optomec Aerosol Jet product manager Mike O’Reilly will give a presentation titled "Aerosol Jet Printing as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications" at the IMAPS Device Packaging Conference on March 9.

03/08/2011 

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.

03/07/2011 

The collaboration will result in new applications in multi-chip modules in radar, communication, and electronic warfare systems. The new technology platform would enable miniaturization of wireless applications that are faster, lighter and can withstand higher temperatures.

03/03/2011 

As it developed an improved FPGA technology, the NuPGA team discovered a path for practical monolithic 3D ICs. MonolithIC 3D changed its strategy to focus on monolithic 3D IC technology as a pure IP innovator organization.

03/02/2011 

ALLVIA, through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present "Silicon Interposers Enable High Performance Capacitors."

03/02/2011 

NVIDIA Corporation (NASDAQ: NVDA) has licensed Inter-Chip Connectivity (ICC) technology from SMSC (NASDAQ: SMSC), a leading semiconductor company creating valued connectivity ecosystems.

03/01/2011  Kenneth A Ramsey, Executive Vice President, MCT Worldwide, LLC, Minneapolis, MN USA

02/28/2011 

The new gold/tin (AuSn) process from Stellar Industries is ideally matched to Stellar’s proprietary CPU copper on AlN submounts with its sharp guillotine edge for precise edge alignments.

02/24/2011 

Multitest received its fifth full purchase order for its InCarrier device transfer system with InStrip test handling system adapted to metal frame-based carriers.

02/24/2011 

The Unifire 7900IR provides 3D inspection of wafer-scale packaging features as well as registration for wafer-to-wafer bonding applications for use in advanced wafer scale packaging process control.

02/21/2011 

Tessera Technologies Inc. (NASDAQ:TSRA) announced that on February 17, 2011, it sent Amkor Technology, Inc. an official notice of termination of their license agreement with Tessera. The two companies are currently in arbitration regarding multiple issues.

02/18/2011 

Jamal Izadian, co-founder & president of RFCONNEXT, makes the case for shaped membrane transmission lines (SMTL) for use in high-speed 3D packaging applications. SMTL supports and improves flip-chip, micro-bumping, wafer thinning, system-in-package (SiP), package-on-package (PoP), and other packaging processes by extending the bandwidth and high-speed limits of these technologies.

02/17/2011 

inTEST Corporation (NASDAQ: INTT) subsidiaries, Temptronic and Sigma Systems, both in Sharon, MA, will begin operating under the umbrella trade name, inTEST Thermal Solutions Corp.

02/16/2011 

STATS ChipPAC launched fcCuBE technology, an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes. STATS ChipPAC claims the flip chip package is cost-comprable to standard packaging processes, and compatible with shrinking semiconductor device nodes down to 28nm.

02/15/2011 

InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot-based QuantumFilm technology and products into mass production.

02/14/2011 

Dave Rose, Keithley Instruments, addresses specific cabling techniques for DC, multi-frequency capacitance, and ultra-fast I-V and pulse testing, as well as the importance of proper grounding and shielding, choosing the proper interconnect for a specific measurement, and troubleshooting common interconnect problems.

02/13/2011 

Hitachi Chemical has granted Henkel a worldwide license for the manufacture and sales of certain dicing die attach film.

02/11/2011 

Altera closed the gap on Xilinx considerably in 2010, but Xilinx's competitive 28nm product should enable it to stay at the top of the FPGA market. Start-up Achronix could be the first to reach 22nm because of its Intel connection. The Linley Group's FPGA report, "A Guide to FPGAs," covers competitors within the FPGA space, as well as FPGA adoption in the chip industry.