11/07/2017  The RC delay issues started a few nodes ago, and the problems are becoming worse.

11/06/2017  The Broadcom proposal stands whether Qualcomm's pending acquisition of NXP Semiconductors N.V. is consummated on the currently disclosed terms of $110 per NXP share or the transaction is terminated.

11/01/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter.

10/24/2017  The number of IC packages utilizing wafer-level packaging (WLP) will overtake flip chip shipments in 2018 and then continue growing at a compound annual growth rate of 15% (between 2014 and 2020) compared to just 5% for flip chip, according to the report recently published by The Information Network.

10/18/2017  The annual revenue from the global IC testing and packaging industry for 2017 is estimated to grow by 2.2% to reach US$51.73 billion, according to the latest research from TrendForce.

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

10/13/2017  Leti, a research institute of CEA Tech, will hold a workshop on Oct. 17 to present updates on their progress developing CoolCube high-density 3D sequential, monolithic-integration technology, and their supporting design-and-manufacturing ecosystems.

10/13/2017  A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers fades.

10/10/2017  The global CMOS image sensor market is expected to grow at a CAGR of more than 12% during the forecast period, according to Technavio’s latest market research.

10/04/2017  Worldwide sales up 24 percent year-to-year and 4 percent month-to-month; Americas market leads the way with growth of 39 percent year-to-year and 9 percent month-to month.

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

10/02/2017  The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee.

09/26/2017  Last year was a great year for photovoltaic (PV) technology.

09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

09/20/2017  Sales of ICs built using <40nm process technology forecast to rise 18% at pure-play foundries.

09/18/2017  Decades ago, the Moore's law predicted that the number of transistors in a dense integrated circuit doubles approximately every two years. This prediction was proved to be right in the past few decades, and the quest for ever smaller and more efficient semiconductor devices have been a driving force in breakthroughs in the technology.

09/15/2017  Researchers and exhibitors will showcase their work during a comprehensive conference program of technical papers, panels, special sessions, short courses/tutorials, and an exhibition that will spotlight premier work in the fields of microelectronics, semiconductor packaging and circuit design.

09/15/2017  Cadence Design Systems, Inc. today announced that John Wall, corporate vice president of finance and corporate controller of Cadence, has been appointed senior vice president and chief financial officer of Cadence, effective October 1, 2017.

09/14/2017  Despite a slightly down first quarter, the semiconductor industry achieved near record growth in the second quarter of 2017, posting a 6.1 percent growth from the previous quarter, according to IHS Markit.