07/06/2004  (PRNewswire-FirstCall, June 15, 2004) Pleasanton, Calif.—ASAT Holdings Limited, a global provider of semiconductor assembly, test and package design services, announced its participation at the International Microelectronics and Packaging Society (IMAPS) Flip Chip Technology Conference, which takes place June 24 in Austin, Texas.

07/02/2004  (July 2, 2004) Jersey City, N.J.—Cookson Electronics Assembly Materials will implement a tin surcharge on all invoices for ALPHA solder paste as soon as the London Metal Exchange (LME) price exceeds $9,500 per metric ton. The surcharge will cover the dramatic increase in the cost of tin, which has more than doubled in the last six months versus the previous two-year average.

07/01/2004  NEW PACKAGING CONCEPT PROVIDES RELIABILITY

07/01/2004  DEVELOPMENT OF ADVANCED STRIPPING CHEMISTRIES

07/01/2004  FATIGUE MODELING

07/01/2004  OVERMOLDING PROVIDES COST, RELIABILITY AND MANUFACTURING IMPROVEMENTS

07/01/2004  We all know that you can do well by doing good, right? When it comes to lead-free, many advanced packaging OEMs have already made an announcement of compliance.

07/01/2004  Last week, the Microelectronic Packaging and Test Engineering Council (MEPTEC) held what it hopes to be the first of many semiconductor assembly and test services (SATS) investor conferences.

07/01/2004  Sandia National Laboratories and Fujitsu conceived the wafer-level package (WLP) in the mid 1990s.

06/14/2004  (June 14, 2004) Des Plaines, Ill. and Phoenix — In a joint collaboration, Kester and FlipChip International (FCI) have worked side by side to introduce SE-CURE 7501, a low void wafer bumping solder paste formula designed for FCI's proprietary wafer bumping application.

06/01/2004  (June 1, 2004) San Jose, Calif.—Worldwide sales of semiconductors rose to $16.94 billion in April, a sequential increase of 4.1 percent from the $16.28 billion reported in March, and a 36.6 percent increase from April 2003, according to the Semiconductor Industry Association (SIA). April is traditionally a strong month for semiconductor sales.

06/01/2004  Solder bump and adhesive flip chip advantages

05/18/2004  May 17, 2004 -- Amkor Technology Inc. has entered into a strategic long-term agreement with IBM for semiconductor assembly and test services. Some of the details include Amkor acquiring IBM's manufacturing complex in Shanghai, China, and its Singapore test operations.

05/17/2004  (May 17, 2004) Busan, Korea—The World Semiconductor Council, representing the European, Japanese, Korean, Taiwanese and U.S. semiconductor industries, met last week in Busan, Korea for its 8th annual meeting to address a number of public policy issues, including intellectual property, environment, trade and other issues.

05/13/2004  (May 13, 2004) Cleveland, Ohio—Demand for electronic polymer products is on target to expand 13.3 percent per year to $4.5 billion by 2008, according to Electronic Polymers, a recent study from The Freedonia Group Inc., an industrial research firm. Production of these products will require 510 million lbs. of resin valued at $2.2 billion, and growth is expected to be driven by a strong recovery in the semiconductor industry and a shift to new technologies.

05/03/2004  (May 3, 2004) San Jose, Calif.—Worldwide sales of semiconductors rose to $16.28 billion in March, a sequential increase of 4.4 percent from the $15.58 billion reported in February and a 32.3 percent increase from March of 2003, the Semiconductor Industry Association (SIA) reports.

05/01/2004  Late in March, Advanced Packaging's editors and publisher arrived at Windsor Castle Hotel in Windsor, England for a "Meet the Editors" Reception.

05/01/2004  Modeling Methodology

04/20/2004  Advanced Packaging magazine is seeking the finest examples of creative advancement in technology in 19 critical areas. Be sure to enter your company's products and services! The deadline has been extended a week, so you still have time to enter. All entries must be postmarked no later than Monday, April 26, 2004. Click here for the Official Entry Form.

04/20/2004  (April 20, 2004) San Jose, Calif.—North American-based manufacturers of semiconductor equipment posted $1.32 billion in orders in March 2004 (three-month average basis) and a book-to-bill ratio of 1.10, according to SEMI's latest report.