06/15/2017  The need for ever more computational power continues to grow and exaflop (1018 ) capabilities may soon become necessary.

06/15/2017  Yole Developpement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022: +7% in revenue.

06/08/2017  AI is driving the development of 3D TSV and heterogeneous integration technologies.

06/06/2017  New program aims to progress beyond traditional scaling, catalyze next-generation semiconductor technologies.

06/05/2017  Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs.

06/01/2017  Top spenders expected to represent 83% of total semiconductor industry spending this year.

05/22/2017  Amkor Technology, Inc. today announced that it has completed the acquisition of NANIUM S.A., a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions.

05/22/2017  As China embarks on the Made in China 2025 plan with electronics and semiconductor technology as one of the Top 10 focus areas, China's semiconductor industry has an unprecedented growth opportunity.

05/15/2017  Worldwide semiconductor revenue totaled $343.5 billion in 2016, a 2.6 percent increase from 2015 revenue of $334.9 billion, according to final results by Gartner, Inc.

05/01/2017  The Firefly System with Clearfind Technology helps manufacturers find defects earlier in the process – improving reliability of devices.

04/17/2017  According to the latest market study released by Technavio, the electrostatic discharge (ESD) packaging market is projected to grow to USD 5.42 billion by 2021, at a CAGR of more than 8% over the forecast period.

04/17/2017  At SEMICON Southeast Asia 2017, Dr. Chen Fusen, CEO of Kulicke & Soffa Pte Ltd, Singapore, will give a keynote on digital transformation in the manufacturing sector.

04/13/2017  Kulicke & Soffa Industries, Inc. announced today the opening of its latest Process and Applications laboratory at the K&S Netherlands facility.

04/07/2017  Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. today jointly announced the completion of the approximately $500 million acquisition of Analogix Semiconductor.

04/06/2017  2016 was a turning point for fan-out packaging. With Apple’s entrance and its subsequent decision to package its A10 APE in TSMC’s fan-out solution, the market changed.

04/05/2017  Cadence Design Systems, Inc. today announced the release of the new Virtuoso Advanced-Node Platform supporting advanced 7nm designs.

04/04/2017  2016 was the year of strong consolidations in the semiconductor industry. Yole Developpement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.

04/04/2017  Year-to-year sales increased by double digits across most regional markets, with the China and Americas markets showing particularly strong growth.

03/31/2017  Series of nine white papers mark milestone effort for strategic initiative that identifies challenges and solutions to help guide future roadmaps.

03/30/2017  New SIA-SRC report calls for robust research investments throughout the semiconductor industry and value chain.