11/05/2002  Nov. 5, 2002 - Willow Grove, PA - Kulicke & Soffa Industries, the supplier of semiconductor assembly and test interconnect equipment, materials and technology, has announced that it is exploring options for certain of its non-core business units.

11/01/2002  Nov. 1, 2002 - Marlborough, MA - Shipley Company L.L.C., a provider of electronic materials and process innovations for advanced circuit board technology, semiconductor manufacturing, and advanced packaging, has established a partnership for low k1 lithography imaging with Silicon Valley-based Numerical Technologies Inc.

11/01/2002  The term "wafer-level packaging" (WLP) entered the microelectronics industry's lexicon in the late 1990s.

10/17/2002  Oct. 17, 2002 - San Jose, CA -- Tessera Technologies Inc., a provider of chip-scale and multi-chip packaging solutions, has expanded the scope of an existing licensing agreement with Hitachi Ltd.

10/08/2002  U.K. Companies Find Packaging Niches LONDON The United Kingdom is not known as a critical location for semiconductor packaging, but there are numerous companies doing some interesting work there. On a recent vacation to the U.K., I took the opportunity to visit a few places: assembly and test subcontractor Atlantic Technology, equipment manufacturer DEK, and test and inspection specialist Dage Precision Industries. (October 8)

10/01/2002  MEPTEC's latest one-day symposium, "International Wafer- level Packaging Conference: The Convergence of Fab and Assembly," focused on one of the hottest topics in the industry.

10/01/2002  The packaging world has seen profound changes over the decades and we may be faced with another one shortly.

10/01/2002  Package and Board-level Reliability Analysis with CAE

10/01/2002  Since the early 1990s people have been excited about a new generation of consumer electronics — a true "anything, anytime, anywhere" generation that would enable instant communications through a wide range of devices.

10/01/2002  LONDON — The United Kingdom is not known as a critical location for semiconductor packaging, but there are numerous companies doing some very interesting work there.

09/18/2002  Sept. 18, 2002 - South Portland, ME - Fairchild Semiconductor, a global supplier of high performance power products for multiple end markets, has opened a Package and Technology Knowledge Center in Bucheon, South Korea.

09/01/2002  The technical sessions began with the presentation of the IEEE/CPMT Electronics Manufacturing Technology Award to Scott Kulicke of K&S for his "commitment and dedication" and "outstanding leadership and service.

09/01/2002  SAN JOSE, CALIF. - The Advanced Packaging and Interconnect Alliance (APiA) has agreed to work with ACE Semiconductor to provide a 200 mm advanced packaging process line in ACE's Shanghai fab

09/01/2002  Two processes compared

09/01/2002  Second Annual Advanced Packaging Awards

08/30/2002  North Billerica, Mass., USA - MRSI, a Newport Corporation Company, announces the addition of a new underfill system to its 175 product line of dispense systems with the introduction of the MRSI-175UF. This system is targeted specifically to the flip chip underfill dispense market.

08/30/2002  PETALUMA, Calif., July 16, 2002 - Tegal Corporation (Nasdaq: TGAL) today announced that it has been accepted as an associate member of the Advanced Packaging and Interconnect Alliance (APiA), further exemplifying Tegal's commitment to serving the needs of the packaging applications market.

08/30/2002  Adept Joins Alliance as Wafer Handling Automation Expert to Address Packaging Challenges and Solutions

08/30/2002  10 Micron Placement Accuracy

08/30/2002  Breakthrough Technology Delivers up to Eightfold Increase in Memory Density while Significantly Driving Down Stacked Package Costs