08/30/2002  Cham/Switzerland, July 17, 2002 - ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, announces the introduction of a 5 µm Die Attach solution on its Micron 5003 Die and Flip Chip Attach Machine. This tool fulfills an important request from ESEC's customers and will insure more accurate bonding performance and overall superior results.

08/30/2002  Cham/Switzerland, July 18, 2002 - ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, will be presenting a revolutionary technology based on a rotating bondhead, at the world's largest semiconductor trade fair, Semicon West, taking place on July 17-19, 2002, in San Jose, California/USA.

08/30/2002  CHANDLER, Ariz. and RESEARCH TRIANGLE PARK, N.C., July 18, 2002 -- Amkor Technology, Inc. (Nasdaq: AMKR) and Unitive, Inc. have expanded their two-year relationship by entering into a strategic manufacturing alliance to collaborate on turn-key manufacturing services using Unitive's wafer level packaging solutions and Amkor's advanced ackaging and test capabilities.

08/30/2002  San Jose, California, July 22, 2002 -- Universal Instruments is launching its newest flip chip capabilities at SEMICON West 2002 in San Jose at booth 11627. These new offerings include the ability to process bumped devices directly from wafers using either ink dot recognition or wafer map input.

08/29/2002  APiA to open 200 mm development center within ACE Semiconductor's newest advanced packaging fab in Shanghai China

08/29/2002  ALPHARETTA, GA - July 9, 2002 -- Cookson Electronics - Semiconductor Products has introduced STAYCHIP^TM NUF-2076E, no-flow underfill used to perform the dual functions of a solder flux and an underfill between a flip-chip die and a substrate, or an area array device and a printed circuit board.

08/29/2002  Vista, Calif. - July 17, 2002 - Palomar Technologies, the leading manufacturer of automated high-precision assembly systems for broadband communications, introduces Palomar's Gold Connection^TM, consisting of Palomar's new Gold Bumper(tm) and Flip Chip TCB(tm) (Thermocompression Bonder).

08/29/2002  Palomar Technologies, a California-based maker of precision assembly equipment, said it has launched an automated MEMS packaging system.

08/14/2002  Fremont, CA - ChipPAC Inc., a provider of semiconductor assembly and test services, plans to more than double its manufacturing capacity in China.

08/01/2002  The first university course in packaging was offered nearly two decades ago, but the most significant changes in availability and breadth of university-level education programs have occurred in the past 10 to 15 years

08/01/2002  The Advanced Packaging and Interconnect Alliance (APiA) added seven organizations to its roster, increasing the scope of technologies included in its effort to address advanced packaging challenges

08/01/2002  The advantages of the flip chip package over other types of electronic packaging are many, but the most obvious is the reduction in the package size, which delivers savings in board real estate and product thickness.

08/01/2002  With the evolution in front-end semiconductor technology and end product platforms, there is a need for further process development to package these products effectively

07/29/2002  RAVE LLC CEO Barry Hopkins attended the NanoBusiness Spring 2002 conference in hopes of discovering the next generation of customers and applications for his company's photomask-repair tools - hopefully customers in the emerging field of nanotechnology, which could possibly run counter-cyclical to the chip industry's peaks and valleys.

07/18/2002  SAN JOSE, CALIF. On Wednesday, July 17, Advanced Packaging announced the winners of the 2002 Advanced Packaging Awards at a ceremony in the Club Regent Room of the Fairmont Hotel here. (July 18)

07/15/2002  BOXBOROUGH, MASS. At the IMAPS New England Chapter Annual Meeting here on June 18, Advanced Packaging Editor-in-Chief Jeff Demmin shared his thoughts on the state of the advanced packaging marketplace, as well as future directions. (July 16)

07/10/2002  July 10--Kuala Lumpur - Motorola Malaysia Sdn. Bhd. will invest some $65.9 million to expand the capacity of its semiconductor plant and on the transfer of technology, creating 500 new jobs.

07/05/2002  Kuala Lumpur - Motorola Malaysia Sdn. Bhd. will invest some $65.9 million (250 million ringgit) to expand the capacity of its semiconductor plant and on the transfer of technology, which will see the creation of 500 new jobs.

07/03/2002  Think Tank Classics: Noon Day Meal

Click here for the answer to last week's puzzle and a note about the future of Think Tank Classics.

07/02/2002  July 2, 2002 - Munich, Germany - NEXX Systems, a spin-off of ASTeX established in August 2001, and a supplier of PVD systems, has joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP).