07/01/2002  Flip chip challenges

07/01/2002  Standards provide key to progress

07/01/2002  Solutions for high-performance applications

07/01/2002  Today, packaging and assembly of integrated circuits (ICs) can be characterized as an aggressive ongoing development effort

07/01/2002  To assist design engineers working with bare die, the Die Products Consortium (DPC) has created a database of information on available die products

07/01/2002  United Test and Assembly Center (UTAC) is setting up a package design center in Pleasanton, Calif., to support the design needs of customers in North America

07/01/2002  Several announcements by major semiconductor manufacturers indicate the extent to which advanced packaging technologies have permeated mainstream products

07/01/2002  The American Chemical Society has selected Advanced Packaging for inclusion in its Chemical Abstracts Service (CAS)

06/21/2002  (June 24, 2002) San Jose, Calif. -- Held here July 17 through 19, 2002, at the San Jose Convention Center, SEMICON West (Final Manufacturing) is packed with courses, classes and networking opportunities.

06/10/2002  June 10, 2002 - Taipei, Taiwan - Packaging-substrate maker Phoenix Precision Technology Corp. of Taiwan will team up with Intel Corp. to set up an NT$4 billion (US$117.64 million) line to make 3G flip-chip substrates.

06/01/2002  When to use which process, and why

06/01/2002  ASE Test Limited and MTBSolutions (MTBS) announced that they are jointly developing packaging technology for large flip chip devices

05/24/2002  Demmin to Speak at IMAPS Chapter Meeting Tonight
Jeffrey C. Demmin, editor-in-chief of Advanced Packaging magazine, will discuss "The Packaging Landscape -- Business and Technology" today at the IMAPS New England chapter meeting. (June 18)

05/14/2002  Updates on folded flex and thin packaging at ICAPS
RENO, NEV.
The International Microelectronics and Packaging Society held its first International Conference on Advanced Packaging and Systems (ICAPS) in March in Reno. The event featured sessions on most critical areas of advanced packaging technology, including design and test, 3-D packaging, MEMS packaging, and thermal management. Tabletop exhibits accompanied the two parallel technical sessions.

05/01/2002  The Optical Fiber Conference (OFC) in Anaheim in March included announcements of many new packaging technologies and products

05/01/2002  Flip chip is a technology where semiconductor devices are mounted and electrically connected face-down directly onto substrates

05/01/2002  The role and status of the packaging, assembly and test subcontractor has steadily increased over time

05/01/2002  In the very first issue of Advanced Packaging, thermal management was probably the biggest topic

05/01/2002  IMAPS held its first International Conference on Advanced Packaging and Systems (ICAPS) in March in Reno

05/01/2002  Pisctaway, N.J. - The Components, Packaging and Manufacturing Technology Society (CPMT) of the IEEE recently announced the winners of its annual awards for technical excellence, achievement, leadership and service.