05/01/2002  The FXS-160.40 inspection system is designed for off-axis inspection of planar devices

05/01/2002  While putting together our 10th anniversary issue, it was great fun to look through old issues of Advanced Packaging to see what has changed and what hasn't in the past decade

04/16/2002  It seems that the semiconductor IPO well has begun to run dry, at least for the time being. It has been months since a chip-related company has filed for its initial public offering. And yet, if one looks at companies that went IPO during late 2000 into 2001, it seems that the public market has been kind to them.

04/09/2002 
Development of a MEMS-based Braille display system may prove to be a miracle worker for the thousands of blind people unable to access information via computer.

04/01/2002  There have been only a few fundamental shifts in the history of electronic packaging that changed the whole industry. One was the step from through-hole assembly to surface mount technology (SMT)

04/01/2002  Plexus Corp., an electronic manufacturing services (EMS) provider, will be licensing Tessera's chip scale packaging (CSP) and multichip packaging (MCP) technology

04/01/2002  SECAP, the Semiconductor Equipment Consortium for Advanced Packaging, is in its second year now with some interesting projects underway

03/19/2002  March 19, 2002 -- Burlington, MA -- EM4 Photonics, Inc. opened its new facility, located in Burlington, MA. The company's new 15,500 square foot manufacturing facility is an ISO Class 7 cleanroom.

03/01/2002  Intel's Packaging Plans Discussed

03/01/2002  Acoustic micro imaging and destructive correlation

02/25/2002  Feb.25, 2002 - Kaohsiung, Taiwan - Semiconductor packaging and testing company, Advanced Semiconductor Engineering Inc. (ASE), said that its Taiwanese facilities will take a strategic role in Bluetooth's development.

02/22/2002  10th Anniversary Insights Series
In 2002, Advanced Packaging included a special guest column where industry experts discuss the changes they've witnessed during the past 10 years.
Click here to read the columns for 2002.

02/11/2002  It's a testament to the growing importance of advanced packaging technology that two consortiums have sprung up in the past year and a half to lend some corporate organization to the sector - the Semiconductor Equipment Consortium for Advanced Packaging (SECAP) and the Advanced Packaging and Interconnect Alliance (APiA).

02/07/2002  Cool Chips 2002 Conference Lineup
Intertech has a set agenda for its power and thermal management development conference, "Cool Chips 2002 -- Developing New Market, Material and Design Strategies for Thermal and Power Management," which will be held April 3-4 in Monterey, California. With packaging being a critical part of thermal management in electronic products, Advanced Packaging magazine is acting as the media partner for the event.

02/04/2002  Feb. 4, 2002 - Willow Grove, PA - Kulicke & Soffa Industries Inc. is set to cut 200 jobs, and restructure its organization.

02/01/2002  Motorola Semiconductor Products Sector (SPS) has developed and qualified the industry's first wafer-level burn-in and test (WLBT) process for high-performance flip chip microprocessors

02/01/2002  A group of seven companies have begun a collaboration to accelerate the commercial development of advanced packaging technologies, such as wafer-level packaging (WLP)

01/25/2002  Jan. 25, 2002 - Wilmington, MA - BOC Edwards, a supplier of chemical and exhaust gas management systems for the microelectronics industry, announced that it has acquired 100% of Hydromatix Inc., a manufacturer of high-efficiency, process-critical liquid purification systems based in Santa Fe Springs, CA.

01/23/2002  synopsis

01/21/2002  The 2001 Back-End Process: Step-by-Step
Industry newcomers and veterans alike benefit from our monthly series of step-by-step articles that outline the packaging process -- how it's changed, how it's stayed the same and how it's applied today. Click here for this special reference tool.