08/27/2001  Proliferation of Flip Chip Licensing
Recent announcements are an indication that the flip chip processes of a small number of companies are being adopted more and more by IC manufacturers and subcontract assembly houses. This is leading to process consolidation in the industry, with de facto standards arising.
Click here for analysis on this news and more.

08/23/2001  August 23, 2001 - Willow Grove, PA.- Kulicke & Soffa Industries Inc. announced that ST Assembly Test Services Ltd. (STATS) has signed a technology licensing agreement for wafer bumping technology with Flip Chip Technologies L.L.C. (FCT), which is wholly owned by K&S.

08/17/2001  A Few SEMICON Superlatives
Now that the dust has settled, we can report on some of the other interesting things from SEMICON West last month. Instead of the usual updates about who claimed the largest market share, read on for an update on Razor Scooters and booth decor.

08/02/2001  Wafer Level CSP and Flip Chip Packaging
The international workshop will be held in Stone Mountain, Georgia, on March 1-3, 2002. Abstracts are due November 19.

08/01/2001  Zuken addresses time-to-market with predictive analysis tool

08/01/2001  Why are so many upper echelon managers in our industry reluctant to admit what everyone else seems to know: that they have problems in their businesses? Their employees and factory workers, their suppliers and even their competitors know that they have problems

07/24/2001  Semi Dice Celebrates 25 Years of Service
LOS ALAMITOS, CALIF.
For the past 25 years, Semi Dice Inc. has been supplying bare die components to the hybrid, MCM and COB communities. In a recent interview with Advanced Packaging magazine, Mitch Myers, COO of Semi Dice, reflected on the past 25 years in the industry.

07/16/2001  Editorial Call Deadline Today
If you are an exhibitor at IMAPS 2001 this year in Baltimore, don't miss this opportunity to have one of your debut products listed in our special September issue. The deadline is today. Click here for more details.

07/01/2001  Wafer bumping is replacing wire bonding as the interconnection of choice for a growing number of components

06/20/2001  So When Is That Meeting Again?
Don't miss out on the latest news, events and meetings put together by your favorite associations. A list of assocations is right here ready for you to use.

06/14/2001  Nominations Due August 1
Third Annual MicroElectronics Packaging Technologist Award sponsored by MEPTEC and Advanced Packaging magazine recognizes innovative technology in the world of semiconductor packaging and assembly. Click here for more information and a nomination form.

06/01/2001  The most common modern use for lead is in solders for electronics manufacture because of lead's low melting point and corrosion resistance. Historically, lead has been used in a wide variety of ways for thousands of years

06/01/2001  Historically, a rite of passage for a semiconductor packaging professional was the realization that packaging was an afterthought or seen as a necessary evil-or worse-in the IC world. Packaging added cost and leadtime, and more often than not it ruined some perfectly good chips

06/01/2001  Optimizing production throughput by leveraging dual-lane dispensing

05/18/2001  Award Entries Surpass Expectations
In just a few short months, the industry will have a few more stars among them. Partnering with SEMICON West 2001, envelope seals announcing the winners of the the 2001 Advanced Packaging Awards program will be broken on Wednesday, July 18.

05/08/2001 

Engineering Research Center is developing a large-scale treatment for deafness.

05/03/2001  If you are an exhibitor at SEMICON West 2001 this year in San Jose, don't miss this opportunity to have one of your debut products listed in our special July issue. Click here for more details.

05/01/2001  In a response to industry demand for lead-free products and, more specifically, to customer projections to implement lead-free processes, LSI Logic Corp. has introduced a set of lead-free ball grid arrays (BGAs) for use in communication and storage products

05/01/2001  Cathy was driving her daughter, Kathy, to the Advanced Packaging May Day party. Cathy planned to be there 15 minutes early (to straighten the ribbons in Kathy's hair) by driving 60 mph on the highway and 30 mph on the 20-mile stretch of side road.

05/01/2001  Finally, the summer months are upon us. Oftentimes, this can translate into less business travel, as trade shows wind down (revving up for the big SEMICON West show, I suppose) and there are fewer conferences