03/30/2017  Huge spike in DRAM and NAND flash ASPs prompts market forecast revision to 11% increase.

03/27/2017  Silego Technology, a developer of Configurable Mixed-signal Integrated Circuits (CMICs), announced today an extension of its performance-driven GFET3 Integrated Power Switch (IPS) portfolio.

03/23/2017  At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016.

03/15/2017  STATS ChipPAC Pte. Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB).

03/14/2017  Jim Walker, who retired from Gartner and is now consulting as World Level Packaging Concepts, gave a plenary talk at the recent IMAPS Device Packaging Conference in Scottsdale on the state of the semiconductor industry which contained some interesting perspectives on emerging new business models.

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

03/06/2017  Year-to-year growth is market's largest since November 2010; month-to-month sales decrease slightly.

03/03/2017  Yole analysts provide an overview of advanced substrate technologies, markets, and supply chain.

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

02/17/2017  Wafer bonding and 3D interconnect technology to enable delivery of next-generation MEMS and image sensor solutions.

02/17/2017  With this partnership, SEMCO will license GE microelectronics packaging patent portfolio, covering the fabrication of substrates embedded with electronic circuits.

02/17/2017  The explosive growth in demand for internet bandwidth and cloud computing capacity brings a new set of technology challenges and opportunities for the semiconductor supply chain.

02/14/2017  The market is expected to be worth USD 170.46 billion in 2022, at a CAGR of 38.30% between 2016 and 2022.

02/13/2017  The company will continue investing in its wafer plants in the United States and Germany, expand its capacity in Singapore, and construct a facility to produce 12-inch wafers in Chengdu, China in order to satisfy Chinese and global demands for the company's 22FDX technology.

02/10/2017  The company is investing in its existing leading-edge fabs in the United States and Germany, expanding its footprint in China with a fab in Chengdu, and adding capacity for mainstream technologies in Singapore.

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

02/09/2017  Significant and noticeable IC market growth closely tied to significant worldwide GDP growth.

02/07/2017  Former Standard Products Division of NXP combines experience, product and operational excellence with customer focus and ambition.

02/03/2017  Worldwide industry posts highest-ever annual sales; year-to-year sales increase 12 percent in December.

02/02/2017  Amkor Technology, Inc. and NANIUM S.A. today announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions.