01/31/2001  Willow Grove, Pennsylvania--Kulicke & Soffa Industries Inc. and its Flip Chip Technologies, LLC (FCT) joint venture today announced that National Semiconductor Corp., Santa Clara, CA, has signed a license for FCT's wafer bumping technology.

01/29/2001  Singapore--ST Assembly Test Services (STATS), an independent semiconductor testing and advanced packaging service provider, has introduced another IC package for the wired and wireless communications markets. Known as the Stacked Die Ball Grid Array (SDBGA), it is distinguished by its stacking feature, combining various ICs in one package, which can significantly reduce manufacturing costs, testing time, and real estate on the motherboard.

01/22/2001  Nashua, NH - PennWell's Advanced Packaging magazine, the premier technology source for advanced semiconductor packaging, goes monthly starting with January issue.

01/15/2001  Aliso Viejo, California--CR Technology has expanded its worldwide headquarters by 30% to meet the significant increase in demand for its advanced line of vision and x-ray inspection systems. The new 26,000-sq-ft facility allows the company to accommodate the growing sales generated by the printed circuit board (PCB) assembly and semiconductor packaging industries.

01/01/2001  NASHUA, N.H., AND Taipei, TAIWAN - PennWell Publishing and Arco Publishing have recently launched a Chinese/English language edition of Advanced Packaging magazine

01/01/2001  One day recently, out of the blue, my sister Alice made this remark about her three daughters and herself

01/01/2001  Beginning a new year always conjures up all sorts of resolutions... organizing your desk (because it might be condemned by the local fire marshal)...eating the "right" foods (we'll bypass the whole dieting thing altogether)...maybe even setting aside more savings (so we can retire sooner?)

12/26/2000  Singapore--ST Assembly Test Services Ltd. (STATS) is now expecting fourth quarter (Q4) revenues to be flat compared to third quarter revenues of US$90.5 million, with diluted earnings per ADS of about $0.06 to $0.07. The revised expectation for revenues represents a reduction from the prior guidance of 8% to 10% sequential revenue growth, reports the company.

11/29/2000  San Jose, California--Ultratech Stepper, Inc., a supplier of photolithography systems used to manufacture semiconductors, micromachined devices and thin film heads (TFH) for disk drives, today announced the introduction of the Prisma-ghi, a low-cost research and development (R&D) and pre-production flip-chip (bump) stepper.

11/20/2000  Milpitas, California--Nov. 20, 2000--ST Assembly Test Services (STATS), a provider of semiconductor testing and advanced packaging services, has developed a strip handler for the multiple testing of integrated circuits (ICs).

11/01/2000  Donald balanced his family budget with difficulty. He called his three sons - Al, the eldest, Ben and Cory, the youngest (who was four years Al's junior)

11/01/2000  Business models, roadmaps and a little black magic: An interview with Bob Hilton

11/01/2000  What a year this has been! Advanced Packaging magazine has seen many great changes this year: a new and invigorated staff...an enthusiastic publisher...a renewed commitment to the industry...a fresh new design

11/01/2000  Check Out Advanced Packaging's New Redesign!

10/27/2000  Shanghai, China--Oct. 27, 2000--IBM Corp. plans to invest $300 million to build a chip packaging manufacturing facility in Shanghai, China to support the company's growing semiconductor business around the world.

10/24/2000  Singapore--Oct. 24, 2000--As part of a lead-free initiative, ST Assembly Test Services (STATS), an independent semiconductor testing and advanced packaging service provider, has selected a pure tin solder alternative solution for its leaded product offering.

10/19/2000  Chandler, Arizona--Oct. 19, 2000--In response to increased focus on advanced flip chip and system-in-package production, Amkor Technology--a worldwide provider of contract microelectronics manufacturing services--has added the latest equipment from several manufacturers to its expanding prototype package development lab.

10/01/2000  When it's this good, why wait? That was our thinking behind the redesign of Advanced Packaging magazine that you now hold in your hands

10/01/2000  BGAs, BGAs, BGAs everywhere! How many different types of BGAs are there? There are BGAs that use ceramic substrates, organic substrates, flex tape substrates, thin film substrates and metal (leadframe) substrates

10/01/2000  Nashua, NH - PennWell Publishing has announced that Advanced Packaging magazine, the premier business-to-business technology source for advanced semiconductor packaging, will move to a monthly (12-time) schedule in 2001