Wafer Processing

WAFER PROCESSING ARTICLES



SEMI China, CASPA promote China-Silicon Valley innovation partnership

08/08/2018  Aiming to forge stronger ties between the two technology heavyweights as partners in semiconductor industry innovation, SEMI and CASPA (Chinese American Semiconductor Professional Association) in mid July signed a strategic cooperation agreement to promote industry innovation between Silicon Valley and China.

Mid-year global semiconductor sales up 20.4% compared to 2017

08/06/2018  Q2 sales are highest on record, 6.0 percent more than previous quarter, 20.5 percent higher than Q2 of last year.

UMC and Avalanche Technology partner for MRAM development and 28nm production

08/06/2018  UMC will offer cost effective licensing of embedded 28nm non-volatile MRAM macros to its foundry customers.

SEMI High-Tech Facility events: Shaping the future of smart factories in Taiwan

08/02/2018  The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories.

The rebirth of the semiconductor industry

08/02/2018  We’re living in a digital world where semiconductors have been taken for granted. But, Artificial Intelligence (AI) is changing everything – and bringing semiconductors back into the deserved spotlight.

Leti and CMP announce world's first multi-project wafer service with integrated silicon OxRAM

08/02/2018  Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the integrated-circuit industry's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

John Hennessy, Alphabet Chairman and former Stanford President, to receive semiconductor industry's top honor

08/01/2018  Hennessy, pioneer in electrical engineering, will accept 2018 Robert N. Noyce Award at SIA Award Dinner on Nov. 29.

On-chip optical filter processes wide range of light wavelengths

08/01/2018  Silicon-based system offers smaller, cheaper alternative to other 'broadband' filters; could improve a variety of photonic devices.

Avnet expands relationship with Microchip

07/31/2018  Avnet, a global technology company, has been named a global distribution partner for Microsemi Corporation, a wholly owned subsidiary of Microchip Technology, Inc.

SEMI supports congressional calls to remove China trade tariffs

07/31/2018  SEMI today announced its support for calls yesterday by nearly 50 members of Congress for the Trump Administration to remove tariffs on U.S. semiconductor products imported from China.

Rambus appoints Sanjay Saraf to Board of Directors

07/30/2018  Rambus Inc. today announced the appointment of Sanjay Saraf to its board of directors, effective immediately.

Extreme conditions in semiconductors

07/30/2018  Physicists from the Universities of Konstanz, Paderborn and ETH Zurich have succeeded in experimentally demonstrating Wannier-Stark localization.

Second quarter 2018 silicon wafer shipments increase quarter-over-quarter to an alll-time quarterly high

07/30/2018  Reaching their highest recorded quarterly level ever on robust demand, worldwide silicon wafer area shipments rose 2.5 percent in the second quarter of 2018 to 3,160 million square inches from 3,084 million square inches the previous quarter, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SEMI testifies against U.S. tariffs; Members meet with congressional leaders urging trade action

07/30/2018  Two months after opposing $34 billion in U.S. trade tariffs on behalf of the U.S. semiconductor manufacturing industry, Jonathan Davis, global vice president of industry advocacy at SEMI, this week spoke out against an additional $16 billion duties on Chinese goods.

Chipus brings ultra-low-power IP to SiFive's DesignShare ecosystem

07/27/2018  SiFive, a provider of commercial RISC-V processor IP, today welcomed Chipus Microelectronics, a semiconductor company with proven expertise in the development of ultra-low-power (ULP), low-voltage, analog and mixed-signal integrated circuits, to the growing DesignShare ecosystem.

School district of Osceola County first to deliver SEMI High Tech U program

07/26/2018  In a key move to inspire the next generation of innovators, the School District of Osceola County (SDOC) today became the first school district to join the SEMI High Tech U (HTU) Certified Partner Program (CPP), a curriculum that prepares high-school students to pursue careers in STEM fields.

Semiconductor Research Corporation releases $26M in new research funds

07/26/2018  JUMP program funds 24 new research projects to amplify mission of its six innovation centers.

SIA applauds new DoD research partnerships to advance transformative semiconductor technologies

07/25/2018  DARPA selects research teams from industry, academia to receive funding through its Electronics Resurgence Initiative to bolster next-generation semiconductor design, materials, architectures.

Silicon industry veteran joins SiFive executive team

07/25/2018  SiFive, a provider of commercial RISC-V processor IP, today announced Brad Holtzinger as Vice President of Worldwide Sales, where he will work with the existing global portfolio of SiFive customers and onboard new clients seeking to take advantage of the company's market-leading Core IP. 

2018 total wafer demand expected to reach 115.1 million 300mm wafer equivalents

07/25/2018  Semiconductor revenues are expected to increase 12.8% in 2018 as a result of continued strong memory prices.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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