08/21/2012 

An unnamed "major Asian customer" will use Aixtron's Prodos polymer PVD tool to deposit organic polymer thin films for production of flexible electronic devices.

08/21/2012 

Samsung Austin Semiconductor LLC says it will spend "about $4 billion" to renovate and retrofit its existing facility for "full system LSI production," mainly to produce mobile SoCs on 300mm wafers using 28nm process technologies.

08/20/2012 

Applied DNA Sciences, a provider of DNA-based anti-counterfeiting and security solutions, was named by the DoD Defense Logistics Agency as the provider of authentication services for microcircuits supplied by defense contractors.

08/17/2012 

"Bookings and billings for North American semiconductor equipment in July are close to values reported exactly one year ago," said Denny McGuirk, SEMI, noting seasonally slow investment activity.

08/15/2012 

AKHAN Technologies is sharing characterization data relating to its Miraj Diamond materials, gleaned in collaborative work with the CNM at Argonne National Laboratory.

08/15/2012 

At a meeting of its Board, TSMC approved capital appropriations to expand and upgrade advanced technology capacity, and to construct a semiconductor fab building.

08/14/2012 

Printing is emerging as a technology that can replace traditional photolithography processes for electronics manufacturing, reducing costly material use, very complex processes, and expensive equipment.

08/14/2012 

National Central University (NCU) in Taiwan will use an AIXTRON MOCVD system to research GaN-on-Si power semiconductors.

08/14/2012 

Worldwide silicon wafer area shipments increased during Q2 2012, compared to Q1 and to Q2 2011, reports SEMI’s Silicon Manufacturers Group (SMG).

08/13/2012 

Tokyo Electron Limited and FSI International entered into a definitive agreement under which TEL will acquire FSI for approximately $252.5 million.

08/10/2012 

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.

08/10/2012 

In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”

08/09/2012 

AIXTRON launched the PRODOS-200 PVPD system for deposition of organic thin film materials, used to make OTFT displays and OLEDs, and in other manufacturing applications.

08/09/2012 

Heavy monsoons moving through the Philippines are causing floods in and around Manila, the capital. The Philippines is a small but growing area for microelectronics manufacturing and packaging facilities.

08/08/2012 

Citing continued financial struggles in Europe, an inventory buildup at TSMC, and lower US GDP, Semico revised its 2012 semiconductor industry forecast from 8-10% to 6-8%.

08/02/2012 

In the third installment in a series called Process Watch, the authors discuss some of the challenges of 450mm wafers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

08/02/2012 

IC Insights released a Q2 update to its top-20 ranking of semiconductor companies. Three pure-play foundries are in the top 20 ranking, with a cumulative increase of 20% from Q1 2012 to Q2 2012.

08/02/2012 

The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.

08/01/2012 

Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) gained LEED-NC Gold recognition for its 300mm Fab 12A P3 & P4 in Tainan, Taiwan, from the U.S. Green Building Council.

08/01/2012 

Crossing Automation, Inc. announced three new options for the Spartan 300 that deliver an end-to-end contamination-free sorter environment. The new options target high volume manufacturing at 32nm and below.