07/30/2012 

CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.

07/30/2012 

Pfeiffer Vacuum introduced the Sputter Process Monitor SPM 220 and High Pressure Analyzer HPA 220 gas analysis systems to monitor and document vacuum processes.

07/30/2012 

Teknek debuted an elastomer roller care system for all contact cleaning rollers. Unlike IPA cleaning, the elastomer Roller Doctor rejuvenation pad exfoliates the roller surface with a precise quantity of proprietary cleaning solution.

07/27/2012 

EMCORE, compound semiconductor-based components and subsystems supplier, will replace multiple legacy manufacturing systems in its compound semiconductor fab and back-end packaging operations with the Camstar Enterprise Platform.

07/27/2012 

Optomec’s Aerosol Jet deposition tools are being used for printed sensor, display, solar cell, CMOS and passive devices, and other development areas, with new installations at CEA Liten (France), Innovation Lab (Germany) and the University of Sheffield (UK).

07/26/2012 

While communications make up the bulk of analog IC sales, growth is coming from automotive, energy, mobility, and medical/healthcare apps, according to Semico. This semiconductor sector is also moving to 300mm wafer production at smaller device nodes, which offers cost advantages.

07/26/2012 

AIXTRON SE introduced a 5 x 200mm gallium nitride on silicon (GaN-on-Si) reactor design for its G5 Planetary Reactor MOCVD platform. AIX G5+ comprises special reactor hardware and process design, developed with customers in AIXTRON’s R&D lab.

07/25/2012 

GLOBALFOUNDRIES will add 90,000 more square feet of semiconductor manufacturing space to Module 1 of Fab 8 in NY. The completed semiconductor manufacturing area will total 300,000sq.ft.

07/25/2012 

Mattson Technology installed its paradigmE etch system at a major foundry, expanding the tool's customer base.

07/24/2012 

SEMI recently conducted a survey of semiconductor fab equipment and materials suppliers, finding that 60+% of respondents say that IP challenges have had an adverse impact on their companies.

07/24/2012 

SiC is a niche material for semiconductor, power electronics, and LED manufacturing. Yole analyzed patents related to SiC growth and wafer manufacturing to glean trends in production, R&D, top companies, barriers to entry, and more.

07/23/2012 

RED Equipment’s Carl McMahon suggests a different model for handling secondary semiconductor equipment for greater efficiency, cost reduction and quality control: full turnkey services engineered to the fab’s needs without the expense of customization.

07/20/2012 

IPC and JPCA released their first operational-level standard for the printed electronics industry, defining terms and establishes basic requirements for substrate materials used in printed electronics: ceramic, organic, metal, glass and other.

07/20/2012 

"Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy," said Denny McGuirk, SEMI.  "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly."

07/18/2012 

IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers -- Intel, Samsung, Hynix, TSMC, UMC, and Rohm -- with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011.

07/17/2012 

BSE Tech, a BSE Group company, sold diffusion equipment for front-end semiconductor production to Microchip Technology Inc. The equipment will be used in the production of PIC microcontrollers in Microchip’s Tempe, AZ, fab.

07/16/2012 

SEMICON West kicked off with a surprise announcement regarding Intel's investment in ASML, but generally the event highlighted trends “as expected” in the fab supply chain, say Barclays analysts.

07/16/2012 

Oxford Instruments launched the PlasmaPro 100 etch and deposition tool for manufacturing MEMS, HB-LED, semiconductors, and other applications.

07/13/2012 

Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.

07/13/2012 

The overriding message for 2012 is that the roadmap has been largely stabilized with the significant changes that were input last year in the 2012 publication,” said Intel’s Alan Allan, speaking at Semicon West.