Wafer Processing

WAFER PROCESSING ARTICLES


Newport introduces 450mm air bearing stages

07/12/2012 

Newport Corporation introduced a line of high-performance air bearing stages specifically designed for the 450mm semiconductor wafer initiative.
Microelectronics standards leaders honored by SEMI

07/12/2012 

At SEMICON West, SEMI honored six industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries.
Interviews with CEA-Leti researchers at SEMICON West

07/12/2012 

CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.
Q3 semiconductor tool capex pull-back: Seasonal, expect Q4 uptick

07/12/2012 

Barclays Capital is seeing various reasons for a Q3 2012 semiconductor fab order/shipment pull-back, following meetings around SEMICON West 2012. The analysts expect strong orders in Q4.
Semiconductor fab tool capex trends gleaned @ SEMICON West

07/12/2012 

After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.
SEMICON West Day 2: DSA lithography and CMP meetings

07/12/2012 

Blogger Michael A. Fury, Ph.D., Techcet Group, reports on Day 2 of SEMICON West with insights from the Sokudo Lithography Forum and NCCAVS CMPUG meeting, and -- sadly -- none on SEMICON West’s Happy Hour.
Pall joins SEMATECH’s ISMI to address semiconductor fab contamination control

07/11/2012 

Pall Corporation, filtration, separation and purification technology provider, joined the International SEMATECH Manufacturing Initiative (ISMI) program on equipment productivity and factory automation projects to address equipment stability and sustainability challenges as well as next-generation processing issues.
IBM partners with ATMI to address 14nm semiconductor process challenges

07/11/2012 

ATMI Inc. (NASDAQ-GS:ATMI) entered into a joint development agreement with IBM to address critical wet process challenges at the14nm semiconductor node and smaller.
ASM debuts 300mm epitaxy and PEALD/PECVD tools for HV transistor fab

07/11/2012 

ASM International (ASMI) launched advanced deposition systems for epitaxy, PEALD and PECVD. The 2 tools enable high-volume 300mm wafer processing for 20nm and smaller nodes and 3D transistors.
Imec at SEMICON West: Interview with Luc Van den hove

07/10/2012 

Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.
Semiconductor equipment spending to contract 2.6% in 2012, grow in 2013

07/10/2012 

Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.
Semicon West 2012 opens with semiconductor revenue forecasts, high-level perspectives

07/10/2012 

Michael A. Fury, Ph.D., reports from the pre-opening day (July 9) of SEMICON West at the Moscone Center in San Francisco, CA. The first day hosts SEMI’s press conference on semiconductor revenues and the SEMI/Gartner Market Symposium.
ULIS invests EUR20M in advanced IR imaging sensor fab and packaging

07/10/2012 

ULIS invested EUR20 million in a new state-of-the-art facility to meet increasing market demands for IR technology, with a move to 200mm wafers and pixel/wafer-level packaging techniques.
SEMI Board of Directors election brings new and familiar faces

07/10/2012 

SEMI’s annual Board of Directors election results are in, with new directors Jifan Gao, Trina Solar; Nobu Koshiba, JSR Corp.; Sue Lin, Hermes-Epitek; and Natsunosuke Yago, Ebara Corp., joining.
imec chat: Inside a new 450mm cleanroom investment

07/09/2012 

imec will build a 450mm wafer fab cleanroom at the research organization’s site in Belgium, with a new EUR100 million Belgian investment. We caught up with Luc Van den hove of imec to discuss the implications for semiconductor manufacturing at 450mm, how to build a 450mm-capable cleanroom, and more.
More SEMICON West exhibit previews

07/08/2012 

Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.
Top conference reports from H1 2012

07/06/2012 

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
SlurryScope CMP metrology tool qualified at major semiconductor fabs

07/06/2012 

Vantage Technology formally qualified its SlurryScope System for analysis of undiluted slurry used during CMP at major IC production fabs.
Picosecond laser enables new high-tech devices

07/05/2012 

Industrially proven and robust, picosecond lasers are proving their worth in cutting and patterning of delicate materials for a wide variety of industrial applications.
SIA recognizes semiconductor researchers, policy supporters

07/04/2012 

The Semiconductor Industry Association (SIA) presented its 2012 University Researcher Awards to Stanford University professors Krishna Saraswat and Bruce Wooley as well as its 2012 Congressional Leadership Awards to Sen. Carl Levin, Sen. John McCain, Rep. Kevin Brady and Rep. Wally Herger.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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