Wafer Processing

WAFER PROCESSING ARTICLES


UMC licenses IBM’s 20nm, FinFET semiconductor technology

07/03/2012 

Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) has licensed IBM technology to expedite the development of its 20nm CMOS process with FinFET 3D transistors.
Maxim plans major upgrades to US semiconductor fabs

06/29/2012 

Maxim is spending $200 million to upgrade and expand its US semiconductor manufacturing facilities in San Antonio and Dallas, TX; Beaverton, OR; and San Jose, CA. Maxim manufactures about 50% of its products in the US.
ALD partnership enables surface functionalization of powders

06/29/2012 

Cambridge NanoTech entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology that uses thermal and plasma processes.
Productivity challenges identified during ISMI Manufacturing Week

06/28/2012 

Semiconductor manufacturers identified key factory productivity challenges that need to be addressed and shared effective solutions they will need to stay leading-edge and competitive amid turbulent industry transitions during the recent ISMI Manufacturing Week.
Applied Materials targets 3D memory with new Avatar dielectric etch system

06/28/2012 

Applied Materials introduced a new dielectric etch system called the Centura Avatar, which can etch holes and trenches in complex film stacks with depth to width aspect ratios of up to 80:1. It is designed to meet new requirements in creating 3D memory architectures.
2012 “Best of West” award finalists announced

06/28/2012 

Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.
CEA-Leti installs Soitec CVD tool for HKMG and PCM research

06/27/2012 

CEA-Leti installed a CVD tool from Altatech, a subsidiary of Soitec, to research sub-20nm phase-change memory (PCM) and high-k metal gate (HKMG) semiconductor devices.

Edwards tailors vacuum pump for LED, compound semiconductor manufacturing

06/26/2012 

Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.
JPSA picosecond laser micromachining platform reduces debris and thermal damage

06/26/2012 

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
Wafer fabs to spend 8.9% less on equipment in 2012; utilization rates improve

06/25/2012 

Worldwide wafer fab equipment spending will total $33 billion in 2012, down 8.9% from 2011’s $36.2 billion spending level, say Gartner analysts. Chipmakers will spend more than $35.4 billion on WFE in 2013, ramping 7.4% over this year.
Linde supports semiconductor manufacturer with expansion in OR

06/22/2012 

Linde North America is expanding its capacity to supply ultra-high purity (UHP) gases to a major global semiconductor manufacturer’s Pacific Northwest location.
Semiconductor makers focus on flow control and treatment at leading edge; H20 reuse rises

06/22/2012 

Semiconductor manufacturers will spend $2.3 billion in 2012 for flow control and treatment products, shows McIlvaine Company. Even more pure water is required as the line sizes on chips are decreasing. This aspect, coupled with the opportunity for water reuse, is creating new opportunities.
North American semiconductor fab tool makers see 4th month of positive book-to-bill ratio

06/22/2012 

North-America-based manufacturers of semiconductor fab equipment posted $1.61 billion in orders worldwide in May 2012, $1.54 billion in billings, and a 1.05 book-to-bill ratio, shows SEMI.

Asian semiconductor foundry orders Ultratech laser spike anneal system

06/21/2012 

Ultratech Inc. (UTEK) shipped its 50th laser spike anneal (LSA) system, with an order from a major Asian foundry.
Conference Report: TechConnect 2012, Day 1

06/20/2012 

The 2012 TechConnect World Summit, Expo & Showcase opened Tuesday, June 19, 2012 at the Santa Clara Convention Center. The event serves as host to the National Innovation Showcase, whose mission is to accelerate the commercialization of “the world’s top innovations.”
AMAT’s Varian integration continues with Dickerson named president

06/20/2012 

In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
MEMS researchers at UToronto purchase plasma etch tool from Oxford Instruments

06/19/2012 

Plasma etch and deposition processing system maker Oxford Instruments Plasma Technology won an order for its recently launched PlasmaPro Estrelas100 deep silicon etch tool from the University of Toronto.
SEMICON West 2012 exhibits preview: Wafer processing and handling

06/18/2012 

Some of the new and flagship wafer fab products and supporting facility products, like vacuum valves, that will be on the show floor at SEMICON West, from ion implant to MOCVD traps and gas blenders.
Easier manual 450mm wafer carrier handling with H-Square Ergolift

06/18/2012 

H-Square Corp introduced its 450mm Ergolift for handling new 450mm semiconductor wafer FOSB/MACs, which can weigh more than 60lbs.
Panasonic re-ups imec research partnership on CMOS, flexible electronics, more

06/14/2012 

imec and Panasonic Inc. have entered into the next phase of a comprehensive and broadened collaboration agreement for joint R&D on healthcare, wireless communication, flexible electronics and advanced CMOS process technologies.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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