06/01/2012 

A*STAR Institute of Microelectronics and NXP Semiconductors (NASDAQ:NXPI) will collaborate on 200mm GaN-on-Si process and technology development for high-voltage power devices.

05/31/2012 

Sanjay Rajguru, director of ISMI, will present “Tool Obsolescence and the Impact on 200mm Manufacturing” at The ConFab 2012’s final session, Maximizing the Longevity of Investments.

05/31/2012 

Picosun Oy delivered a second PICOSUN ALD tool to Uppsala University’s Ångström Laboratory in Sweden for work on surface treatment of carbon nanostructures, transition metal and compound semiconductor thin film manufacturing, and ultrathin polymer layer deposition on various substrates.

05/30/2012 

Element Six, maker of synthetic diamond supermaterials, opened its first US manufacturing facility in Silicon Valley, housing production, technical, and customer service.

05/29/2012 

In this first installment of a series called "Process Watch,” experts from KLA-Tencor explain why a defect might be classified as “Not Found” or “SEM Non-visual (SNV),” and how a SNV count can disguise or hide real problems.

05/25/2012 

Michael A. Fury reports on the NCCAVS CMP Users Group meeting, held on May 16th.

05/25/2012 

At imec's International Technology Forum, An Steegen, Senior Vice President Process Technology at imec, discusses the three technology knobs that are key for a further system scaling.

05/25/2012 

At imec's International Technology Forum, the research consortium's CEO, Lec van den Hove, draws attention to the need for the industry to solve the world's health problems.

05/25/2012 

At imec's International Technology Forum, Greg Bartlett, CTO of GLOBALFOUNDRIES, said the key to survival in the semiconductor industry is adaptability and collaboration.

05/25/2012 

THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. Check out the top-rated suppliers of wafer processing equipment, by company size and customer ranking.

05/25/2012 

At imec's International Technology Forum, SEMI's Denny McGuirck describes how Moore's Law has been the major driver in the semiconducotr industry.

05/25/2012 

VLSIresearch polled semiconductor manufacturers about their tool suppliers, asking chipmakers to rank equipment providers on customer satisfaction. This year’s results show renewed focus on fab needs.

05/23/2012 

EpiGaN NV opened its GaN epitaxial material production site, on the Research Campus Hasselt in Belgium. EpiGaN’s GaN-on-Si material is used in next-generation power electronics.

05/23/2012 

Axus Technology introduced the Titan Carrier Upgrade for IPEC and Strasbaugh legacy CMP chemical mechanical polishing/planarization (CMP) tools for semiconductor and related manufacturing.

05/23/2012 

North America-based manufacturers of semiconductor fab equipment posted $1.60 billion in orders and $1.45 billion in billings in April 2012 for a book-to-bill ratio of 1.10, according to SEMI.

05/23/2012 

Brown University is using supercomputer simulations to better understand the ion bombardment of metal surfaces used in manufacturing nanoelectronics.

05/23/2012 

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.

05/22/2012 

Indian River State College in FL will be the first college in the southeastern US to offer students access to the instrumentation and curriculum provided by the NanoProfessor Nanoscience Education Program from NanoInk.

05/18/2012 

At The ConFab in Las Vegas, TSMC’s BJ Woo, senior director, Graphic/PLD/CPU Business Development Division, will present “Bridging the Fabless-Foundry Gap.”

05/18/2012 

Barclays Capital updates its wafer fab/semiconductor production equipment (WFE/SPE) capital expenditures expectations for TSMC, Samsung, Intel, UMC, GLOBALFOUNDRIES, SMIC, and Huali.