05/18/2012 

SEMICON West is less than 2 months away, July 10-12 in San Francisco, CA. Plan your attendee schedule now with highlights from the Extreme Electronics “show within a show;” 4 strong keynotes; sessions on device architecture and node shrink, lithography, 450mm wafers and more.

05/15/2012 

Bühler’s acquisition of Leybold Optics from EQT III, for an undisclosed sum, was approved without any restrictions by anti-trust authorities.

05/15/2012 

SPTS Technologies installed a Sigma fxP physical vapor deposition (PVD) system at a Chinese foundry producing RF devices on gallium arsenide (GaAs) substrates.

05/14/2012 

SENSIRION introduced the SLQ-QT105 semiconductor-grade flow sensor for flow rates below 2cc/sec (120ml/min) of hydrocarbon-based liquids, such as photoresists and solvents.

05/11/2012 

Nanotrons Corporation launched the SPray Assisted Layer-by-layer Assembly System (SPALAS) for nano-enabled optical coatings on semiconductor, plastic, and glass substrates using layer-by-layer (LbL) self-assembly.

05/10/2012 

Astro Pak Corporation opened its Class 100 and Class 1000 cleanrooms, recently renovated and expanded, in Downey, CA. The cleanrooms host contract precision cleaning for the semiconductor manufacturing, aerospace, and other industries.

05/10/2012 

Dow Corning will add 2 AIXTRON AIX 2800G4 WW planetary reactor platforms to its silicon carbide (SiC) epitaxy capacity for next-generation power electronics.

05/09/2012 

EMI added two members its North American Advisory Board: Terry Brewer of Brewer Science and Wayne Mitchell of Air Products.

05/09/2012 

Coherent Inc., supplier of laser power and energy management instruments, achieved a certificate of accreditation to ISO/IEC 17025:2005 at its Wilsonville, OR calibration laboratory.

05/08/2012 

University of Warsaw, Poland, researchers will grow GaN materials on a new AIXTRON SE Close Coupled Showerhead MOCVD reactor in a 3 x 2” wafer configuration.

05/08/2012 

Worldwide silicon wafer area shipments increased slightly during Q1 2012 when compared to Q4 2011 area shipments, according to SEMI. Wafer shipments fell 11% from Q1 2011.

05/08/2012 

President Barack Obama toured the SUNY - Albany Nano-Tech Complex today, speaking about the economy and education in the CNSE NanoFab Extension Building.

05/08/2012 

memsstar Limited, deposition and etch equipment supplier to the MEMS and semiconductor industries, named Mike Thompson as CEO.

05/02/2012 

CEA-Leti has introduced the “LETI-3S” concept, for “Silicon Specialty Solutions.” The research is oriented to start-ups, component integrators, fabless or fablite chip companies, and equipment/consumable suppliers.

05/01/2012 

Solid State Technology and SEMI will present the 2012 Best of West product awards at SEMICON West 2012, July 10-12 in San Francisco. Best of West recognizes important product and technology developments in the microelectronics industries.

05/01/2012 

CEA will extend its collaboration with Arkema beyond photovoltaics into microelectronics and organic electronics, setting up two joint public-private research projects in CEA-Leti and CEA-Liten.

05/01/2012 

CVD Equipment completed the sale of its Ronkonkoma, NY, facility, where its Application Laboratory was located. This is part of CVD Equipment’s move to its recently purchased building in Central Islip, NY.

05/01/2012 

Crossing Automation Inc. formed a business unit around 450mm semiconductor wafer automation platforms. The company has a comprehensive line of 450mm wafer handling products currently shipping to fabs and tool makers.

05/01/2012 

Fujitsu Semiconductor will transfer ownership of its Iwate Plant, a semiconductor wafer fab in Iwate, Japan producing system LSI, microcontrollers, etc., to DENSO.

04/30/2012 

A leading semiconductor manufacturer placed a follow-on order with Mattson Technology Inc. (NASDAQ:MTSN), wafer fab equipment supplier, for a Millios millisecond annealing system (MSA).