Wafer Processing

WAFER PROCESSING ARTICLES



Semiconductor wafer fab equipment trends

04/10/2012 

Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment (WFE) spending, with a look at the top players and underlying trends by process step.

Semiconductor wafer fab equipment trends: Deposition

04/10/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse separates the rising and declining styles of deposition.

Semiconductor wafer fab equipment trends: Wafer clean

04/09/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at trends in wafer cleaning, such as single wafer and bevel clean.

Semiconductor wafer fab equipment trends: Etch

04/09/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse explains changes at the etch step.

Semiconductor wafer fab equipment trends: Ion implant

04/09/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by step. Barclays looks at the possibilities for ion implant.

Wafer fab equipment leaders in 2011 and expectations for 2012

04/09/2012 

Barclays Capital looks at wafer fab equipment trends in 2011, based on Gartner data. Top 5 takeaways? The top 5 vendors continue to gain market share, Intel is a key customer, segment-leading vendors strengthened their holds, intensity edged higher, and changes are in store in 2012.

Tanaka Precious Metals platinum electrode enables ozone-based semiconductor cleaning

04/09/2012 

Tanaka Kikinzoku Kogyo K.K. developed a platinum electrode that produces ozone solution at 40x the efficiency of existing technology.

Semiconductor makers spend record amount on materials for second straight year

04/03/2012 

The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.

Top 10 semiconductor foundries in 2011

03/30/2012 

The worldwide semiconductor foundry market totaled $29.8 billion in 2011, a 5.1% increase from 2010, according to Gartner. Given aggressive foundry spending in 2010 and 2011, oversupply was "inevitable," Gartner says.

Semiconductor wafer fab utilization rates bucked expectations in late 2011

03/29/2012 

The Global Semiconductor Alliance (GSA) released its GSA Q1 Wafer Fabrication & Back-End Pricing Reports, tracking fab utilization rates, wafer and mask costs, and package pricing.

Applied Materials analyst day preview

03/26/2012 

Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.

ARM’s Segars sees changing requirements for electronics driven by mobile

03/26/2012 

At the recent Common Platform Technology Forum -- produced by Global Foundries, Samsung and IBM -- Simon Segars, executive vice president and general manager of the physical IP division at ARM, spoke about the impact of the internet of things and mobile computing on the way electronics are designed and used.

SEMICON Europa 2012 seeks presenters

03/23/2012 

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.

North American semiconductor fab equipment sales above parity in February

03/23/2012 

North America-based makers of semiconductor equipment posted $1.33 billion in orders in February 2012, $1.32 billion in billings, and a book-to-bill ratio of 1.01, according to SEMI.

DOW opens semiconductor/display R&D center in Seoul with OLED focus

03/22/2012 

The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.

DOW CMP slurry boasts lower defects and better removal rates

03/21/2012 

Dow Electronic Materials released KLEBOSOL II 1730 colloidal silica slurry for CMP of inter-layer dielectrics and post-metal buff.

Taiwan allows higher Chinese investments in LCDs, semiconductors, fab equipment, more

03/21/2012 

Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.

Semiconductor capex to fall 11.6% in 2012, says Gartner

03/21/2012 

Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.

Fraunhofer delivers 300mm wafer processing to North America with Axus Technology

03/21/2012 

Fraunhofer IZM and Fraunhofer CNT will use CMP supplier Axus Technology exclusively to provide advanced 300mm wafer process development and foundry services to North American customers.

AMEC installs dielectric etch tool in China for 28nm fab

03/20/2012 

AMEC installed a second-generation dielectric etch tool, the Primo AD-RIE, at Chinese foundry SMIC. It is the first time AMEC has installed the Primo AD-RIE in China.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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