Wafer Processing

WAFER PROCESSING ARTICLES



North American semiconductor equipment industry posts June 2018 billings

07/25/2018  Global billings of North American equipment manufacturers declined for the current month by 8 percent from the historic high but is still 8 percent higher than billings for the same period last year.

Toshiba Memory Corporation develops 96-layer BiCS FLASH with QLC technology

07/23/2018  Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.

Rahul Goyal of Intel elected Board Chair of Silicon Integration Initiative

07/19/2018  Rahul Goyal of Intel has been elected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

Semi content in electronic systems forecast to reach 31.4% in 2018

07/19/2018  Semi content to surpass 30% this year, smashing the previous record high set just last year.

Silicon Labs expands senior management team

07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

imec shows integrated 5G chip directions

07/12/2018  To fulfill the promise of the Internet of Things (IoT), the world needs low-cost high-bandwidth radio-frequency (RF) chips for 5th-generation (5G) internet technology.

China's semi capex forecast to be larger than Europe and Japan combined in 2018

07/12/2018  The Mid-Year Update to the 2018 McClean Report revises IC Insights’ worldwide economic and IC industry forecasts through 2022 that were originally presented in The 2018 McClean Report issued in January.

HEIDENHAIN announces new CEO

07/11/2018  HEIDENHAIN announced the appointment of David Doyle as CEO of HEIDENHAIN CORPORATION, effective Oct. 1, 2018.  At that time, Doyle will assume full responsibility for the HEIDENHAIN CORPORATION customer-focused operations for the U.S., Canada and Mexico.

Leti and Soitec launch a new substrate innovation center to develop engineered substrate solutions

07/11/2018  Industry-inclusive hub promotes early collaboration and learning from substrate to system level.

The outlook for new metrology approaches

07/10/2018  To keep up with Moore's Law, the semiconductor industry continues to push the envelope in developing new device architectures containing novel materials.

Getting to 3nm: It really is scaling every which way!

07/10/2018  This year’s Scaling Technologies TechXPOT at SEMICON West (Scaling Every Which Way! – Thursday, July 12, 2:00PM-4:00PM) will provide an update on the evolution of scaling and describe how the various players (foundry, IDM, fabless, and application developers) are jockeying for innovation leadership.

High gas flow rates create pumping challenge

07/10/2018  Increasingly complicated 3D structures such finFETs and 3D NAND require very high aspect ratio etches. This, in turn, calls for higher gas flow rates to improve selectivity and profile control. Higher gas flow rates also mean higher etch rates, which help throughput, and  higher rates of removal for etch byproducts.

Proving the benefits of data analysis

07/10/2018  The semiconductor industry is collecting massive amounts of data from fab equipment and other sources. But is the trend toward using that data in a Smart Manufacturing or Industry 4.0 approach happening fast enough in what Mike Plisinski, CEO of Rudolph Technologies, calls a "very conservative" chip manufacturing sector?

SEMI announces re-election of Board Members

07/10/2018  SEMI today announced the re-election of 10 current members to the SEMI International Board of Directors in accordance with the association's by-laws.

Photonics integration coming

07/09/2018  Increasingly, the ability to stay on the path defined my Moore's Law will depend on advanced packaging and heterogeneous integration, including photonics integration.

Capturing future sources of profitable growth

07/09/2018  The semiconductor industry is facing key challenges. In recent years, M&A mega deals have led to consolidations within the market, while the industry continues to mature.

Material innovations for advancements in fan-out packaging

07/09/2018  The development of a new class of materials with superior functionalities is essential to enable emerging process schemes for wafer- or panel-level FO packaging.

Big changes at the top and bottom of Q1 semiconductor equipment market shares

07/09/2018  Market shares of semiconductor equipment manufacturers shifted significantly in Q1 2018 as Applied Materials, the top supplier dropped, according to the report “Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts,” recently published by The Information Network.

SEMICON West 2018 highlights smart technologies, workforce development, industry growth

07/09/2018  Smart technologies take center stage tomorrow as SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, opens for three days of insights into leading technologies and applications that will power future industry expansion.

$62.7B semiconductor equipment forecast: Top previous record, Korea at top but China closes the gap

07/09/2018  Releasing its Mid-Year Forecast at the annual SEMICON West exposition, SEMI, the global industry association representing the electronics manufacturing supply chain, today reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase 10.8 percent to $62.7 billion in 2018, exceeding the historic high of $56.6 billion set last year.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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