09/12/2011 

Brooks Instrument launched a new Safe Delivery System (SDS) option for its GF120 mass flow controllers. The GF120 SDS is a low-pressure drop mass flow controller that delivers sub-atmospheric SDS gases used in implant and etch processes.

09/12/2011 

Fabricated silicon parts for semiconductor and LED equipment use made up a $310 million market in 2010, according to the Techcet Group. By 2014, the market will reach $412 million.

09/09/2011 

Gallium nitride (GaN) based devices are launching for applications in defense, wireless infrastructure, CATV, satellite and power electronics markets, according to the Strategy Analytics GaAs and Compound Semiconductor Technologies Service viewpoint.

09/09/2011 

Lam Research Corporation (NASDAQ:LRCX) will transition Martin B. Anstice to CEO with the new year. Anstice has spent 10+ years with LRCX, including his roles as president and COO (current), and CFO.

09/08/2011 

SEMI and the SEAJ gathered semiconductor manufacturing equipment sales and shipments data from over 100 global equipment companies for their Q2 report. While shipments (billings) rose 31% over Q2 2010, sales (bookings) fell 8% YOY.

09/07/2011 

EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.

09/07/2011 

Mattson Technology received multiple follow-on orders for its SUPREMA photoresist strip systems from major customers fabs in Asia, Europe and the US for volume production of advanced logic, foundry and flash memory devices for 3Xnm and below technology nodes.

09/07/2011 

Unisem installed a V93000 Port Scale RF tester from Verigy, an Advantest Group company, at its European test development center in Wales. Unisem will test and develop wireless RF and complex mixed-signal semiconductors.

09/07/2011 

Noting caution in the markets, SEMI has revised its World Fab Forecast to a 23% year-on-year increase, down from the 31% growth forecast in May 2011. Capital expenditure will still increase to $41.1 billion in 2011.

09/06/2011 

The SIA's latest monthly numbers suggest the chip market remains stalled, though some industry watchers still hope for a seasonal growth push in 4Q11.

09/01/2011 

Semico predicts that the semiconductor manufacturing industry is undergoing a three-quarter (Q3 2011-Q1 2012) downturn, with foundries trimming capital expenditures and OEMs holding excess inventory.

08/31/2011 

Extreme ultraviolet (EUV) lithography introduces new patterning distortions -- flare along with proximity effects -- that must be accurately modeled and corrected on the reticle. James Word and Christian Zuniga of Mentor Graphics discuss an all model-based approach to flare compensation.

08/31/2011 

With PC demand waning, reports indicate Intel is rethinking part of its 22nm investment plans, which would dent industrywide capex forecasts for 2012.

08/31/2011 

Mark Danna, Owens Design's VP for new business development, covers the questions to ask when you’re looking for the right outsourcing partner on a particular project. This article is part of a series from Owens Design on outsourcing decisions.

08/31/2011 

Ziptronix Inc. has licensed use of its oxide bonding technology for backside illumination imaging sensors patents to Sony Corporation. ZiBond technology enables more die per wafer, improving costs and quality for consumer, automotive, and other end-use applications.

08/30/2011 

SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.

08/29/2011 

GLOBALFOUNDRIES entered into a strategic partnership with Amkor (NASDAQ:AMKR) to develop integrated semiconductor assembly and test processes for advanced silicon nodes. The aim is integrated fab-bump-probe-assembly-test steps that can be commercialized across multiple customers and end-market applications.

08/29/2011 

Alpha and Omega Semiconductor will exercise an option to acquire 200mm wafer fabrication facility assets from Integrated Device Technology, taking it from fabless to fab-lite for faster time-to-market for high-value products, along with expansion into new markets.

08/26/2011 

Slowing foundry demand, lower utilizations and "an awful lot" of equipment reuse at 28nm, DRAM going nowhere, and debate about how long into 2011 it'll all last -- all these were top of mind among AMAT executives and industry watchers after the company released its fiscal 3Q11 (July quarter) results and commentary.

08/26/2011 

Imec highlights recent research on using CVD, and commercially available precursors, to grow GeSn in a manner that could be replicated on 200mm and 300mm wafer production environments.