05/13/2011 

Nanotronics Imaging LLC launched the nSPEC semiconductor analysis system with proprietary software and hardware for rapid and detailed analysis of wafer defects. Complete system automation with cassette-to-cassette loading of 2-8" wafers is available.

05/13/2011 

The SD1024FL spectrograph replaces Verity Instruments' SD1024DL with improved line-shape uniformity, resolution, and noise equivalent power, as well as a second-order blocking addition.

05/12/2011 

Rudolph Technologies (NASDAQ: RTEC) released the Wafer Scanner 3880 to inspect micro and standard bumps, through silicon via (TSV) post-via-fill copper protrusions (nails) and re-distribution layers (RDL) used in 3D IC packaging.

05/11/2011 

Worldwide silicon wafer area shipments decreased slightly during the first quarter 2011 when compared to fourth quarter 2010 area shipments, and were marginally higher than first quarter 2010, according to the SEMI Silicon Manufacturers Group.

05/10/2011 

Novellus Systems (NASDAQ: NVLS) subsidiary Peter Wolters GmbH introduced innovative gap measurement technology for double-side silicon prime wafer polishing. New high-resolution sensors and software algorithms increase control of wafer quality, as well as throughput for the AC2000-P³ system.

05/09/2011 

Peter Singer recently toured the Center for Advanced Materials Processing (CAMP) at Clarkson University. The following video interviews with researchers and professors cover particle transport, chemical-mechanical planarization (CMP), cleanroom technologies, and bright nano particles, among other topics.

05/06/2011 

Total wafer demand will increase 11.2% to 185.3M wafers (200mm equivalent), with a number of factors driving growth above average rates, according to a recent Semico Research report.

05/05/2011 

As a follow-up Intel's announcement of a new 22nm trigate transistor structure, we polled and tracked multiple industry watchers for their thoughts on the technology. Their key takeaways: Intel reasserts its manufacturing prowess, and could be setting up for plays in mobile and foundry.

05/05/2011 

 IXYS Corporation (NASDAQ:IXYS) and General Motors Components Holdings (GMCH) entered into an agreement for the fabrication of power semiconductor wafers at the Kokomo, IN plant.

05/01/2011  RDL technology has been instrumental in the development of many advanced packaging technologies such as fan-in and fan-out WLP, and TSV applications. Philip Garrou, MCNC, Research Triangle Park, NC; Alan Huffman, RTI Int., Research Triangle Park, NC

05/01/2011  Copper barrier solutions exist that ensure electrical and reliability performance even as device scaling continues. Harry Whitesell, Eric Hollar, Kang Sub Yim, Li-Qun Xia, Thamos Nowak, Applied Materials, Santa Clara, CA USA

04/28/2011 

Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami: Updates on upcoming summertime electricity demand, Renesas and SEH restarting operations, and more travel tips to Japan.

04/28/2011 

ASM International N.V. (NASDAQ: ASMI) received multiple system orders for its plasma enhanced atomic layer deposition (PEALD) reactor from a leading memory customer in Asia. The company also qualified a new PEALD oxide application with a memory manufacturer for the 2X nm node.

04/26/2011 

SPP Process Technology Systems (SPTS) won a multi-system order for its Sigma PVD, Omega Etch and Delta CVD wafer processing systems from a leading outsourced semiconductor assembly and test (OSAT) provider in the Asia-Pacific region.

04/25/2011 

As SEMI's numbers for semiconductor manufacturing equipment climbed again in March, one slice of the data suggests that the backend-as-leading-cyclical-indicator wisdom we've been taught to follow may not be valid this time around.

04/21/2011 

Brooks Automation Inc. (Nasdaq:BRKS) will sell its contract manufacturing business to Celestica Inc. for approximately $80 million in cash. Cash generated from this transaction will fund initiatives that leverage its existing technology capabilities, particularly into market sectors other than wafer frontend semiconductor capital equipment.

04/21/2011 

Aerotech's AVS1000 series stages suit applications that require positioning of large or heavy loads over very small incremental movements in elevation above a horizontal plane. A low profile and precise motion capability make these stages a fit for semiconductor manufacturing and inspection.

04/20/2011 

Kilopass Technology Inc., semiconductor logic non-volatile memory (NVM) intellectual property (IP) provider, unveiled Itera, an embedded multi-time programmable (MTP) NVM in 40nm.

04/20/2011 

Boston Semi Equipment acquired the assets of Asia Tech Corporation, launching BSE Tech LLC. BSE Tech will deliver pre-owned front end semiconductor manufacturing equipment and spare parts, technical capabilities and financial solutions from a larger facility, with added cleanroom space.

04/19/2011 

Picosun Oy has launched production of plasma enhanced ALD (PEALD) systems based on a highly advanced ion-free remote plasma source, Picoplasma. Various excited species such as oxygen, nitrogen and hydrogen radicals with zero charge can be generated to broaden the range of ALD process chemistries.