|
|
WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
Sponsored By:
Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
Sponsored By:
More Webcasts
|
Ionizers can improve wafer back- and frontside particle performance in PVD processing tools by removing surface charges that hold electrostatically adhered particles. Controlling charges results in higher yields for chip manufacturers and improved tool performance. Viraj Pandit and Emery Kuo, Novellus Systems and Cheryl Avery, ION Systems show that the INOVA PVD system’s good particle performance (with good quality wafers) is made more robust with an ionizer installation (with marginal quality wafers).
Wafer fab capex in 2011 is expected to stick around 2010 levels. But don't despair of growth, says Dean Freeman of Gartner. For one thing, cutting-edge wafer fab equipment will be hot. On top of that, 2011 will be a brief respite, with a strong 2012/2013 waiting in the wings.
Dan Armbrust, SEMATECH, spoke about the role of collaboration in his SEMI Industry Strategy Symposium presentation. Significant technology transitions facing the semiconductor industry include lithography (introduction of EUV), interconnects (TSVs and 3D packaging), and productivity (450mm wafer manufacturing). Additionally, disruptive technology in logic and memory devices will challenge the industry.
Spacers are considered "conventional materials," and thus an odd topic for the cutting-edge IEDM. ASM CTO Ivo Raaijmakers points out that semiconductor fab below 22nm will require different processes for spacers: atomic layer deposition (ALD) and plasma-enhanced ALD (PEALD).
CyberOptics Semiconductors updated its wafer vibration monitoring software, offering new capabilities for data analysis and third-party data interfaces. CyberOptics’ AVS 2.0 vibration monitoring software provides engineers with the data needed to predict equipment failures related to vibration during semiconductor fabrication to improve process yield and cycle times.