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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Jonathan Rullan et al compare resistance from chemical vapor deposited (CVD) ruthenium liners and direct seed (DS) copper used with advanced Electrofill processes to conventional methods, using different annealing temps and simulated back-end-of-line (BEOL) thermal stress builds. 2X nm trenches were shown to have complete gap fill, eliminating the need for conventional PVD Cu seed.
Researchers with the U.S. DOE's Berkeley Lab have been able to fabricate nanochannels that are only 2nm in size, using standard semiconductor manufacturing processes. These channels function differently than their larger counterparts.