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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Laura Peters, contributing editor, discusses TSMC's HfZrO/TiN stack, fabricated by a novel multi-deposition, multi-anneal process. TSMC will present the results at the upcoming International Electron Devices Meeting (IEDM, San Francisco, CA, December 6-8, 2010) with researchers from the Nanyang Technological University (Singapore).
Over the years, undesirable process effects related to ion implantation have become well known: the like channeling effect, for example, and how to minimize it for 25μm and 13μm mature technology. Patrick Demarest, Altis Semiconductor, describes how a stable process can emerge in data mining analysis for low final test yield, and provides definitions for incidence, tilt and twist angles, and channeling effects.