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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Mattson Technology Inc. (NASDAQ: MTSN), advanced wafer fab process equipment supplier, received orders for multiple Suprema photoresist strip systems from a new Asian customer. The Supremas will be used in both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications for advanced logic device production.
DEK has launched ProActiv process technology to enable electronics manufacturers to print pastes with high-density heterogeneous PCBs and ultra fine pitch assemblies such as advanced package assembly.
Keithley Instruments Inc. (NYSE:KEI) updated its ACS Basic Edition Semiconductor Parametric Test Software for semiconductor test and measurement applications. ACS Basic Edition Version 1.2 performs characterization of component or discrete (packaged) semiconductor devices.
Cascade Microtech (NASDAQ: CSCD), supplier of production probe cards with signal integrity for multi-site die testing, released S-Technology, which provides a unique mechanical architecture for Pyramid probe cards to consistently deliver evenly distributed contact force for solder bump technologies in die tests.
Robert Pagliaro, RP Innovative Engineering Solutions, demonstrates that simple but effective enhancements to wet clean steps can help achieve more stringent surface preparation and reduce complexity, cost of ownership (COO), and environmental concerns associated with existing methods. Contamination left or caused by cleaning and drying steps can adversely affect wafer yields.
Jeff Schake, et al, DEK Printing Machines, discuss the flatness characteristics of available wafer pallets, and use them in an experiment with thinned wafers in automated printing. With thin wafers, and the requirement for low coating thickness, the wafer-support tooling surface metrology should have an appreciable impact on coating thickness control.
The IC community has been searching for a manufacturable low-k dielectric which could scale to below K = 2.0, says Dr. Phil Garrou. Microindent photos of uLK 124, released by SBA Materials show a clean ductile indent. SBA reports that their uLK materials can be integrated into existing fab lines using equipment and process flows already in place.