Wafer Processing

WAFER PROCESSING ARTICLES



Toshiba Corporation welcomes Nobuaki Kurumatani as Chairman and CEO

04/02/2018  Nobuaki Kurumatani today took office as the first Chairman and CEO of Toshiba Corporation to be appointed from outside the company in over 50 years.

SiFive secures $50.6M funding to advance RISC-V based semiconductors

04/02/2018  SiFive, a provider of commercial RISC-V processor IP, today announced it raised $50.6 million in a Series C round led by existing investors.

Engineers turn plastic insulator into heat conductor

04/02/2018  Technique could prevent overheating of laptops, mobile phones, and other electronics.

Mattson Technology announces products for atomic level surface engineering and ultra-selective material removal

03/30/2018  Mattson Technology introduces Novyka product family, an innovative technology for atomic level surface treatment and ultra-selective etching of extremely thin and delicate materials for continued scaling of 3D logic and memory devices.

With its highest growth rate in 14 years, the global semiconductor industry topped $429B in 2017

03/30/2018  Samsung edged out Intel, to become the new semiconductor industry leader.

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.

Inside an Intel chip fab: One of the cleanest conference rooms on Earth

03/29/2018  To avoid contaminating the chip-making process, the air in an Intel fab clean room is filtered to 1,000 times fewer airborne particles than a sterile hospital operating room.

More than Moore’s overall wafer demand is driven by the megatrends

03/29/2018  The wafer demand is expected to reach more than 66 million 8-inch eq. wafers by 2023, with an almost 10% CAGR between 2017 and 2023.

NVIDIA and Arm partner to bring deep learning to billions of IoT devices

03/28/2018  NVIDIA and Arm today announced that they are partnering to bring deep learning inferencing to the billions of mobile, consumer electronics and Internet of Things devices that will enter the global marketplace.

ON Semiconductor names 2017 Supplier Award winners

03/28/2018  ON Semiconductor today announced it has recognized 20 companies with supplier excellence awards.

Making the most of color in your multi-patterning layouts

03/28/2018  There are many different situations in which special attention to color choices provide the potential to improve the manufacturing results of multi-patterned masks.

Exploring the thermoelectric properties of tin selenide nanostructures

03/27/2018  Researchers discover that nanometer-thick tin selenide crafted in thin films of connected 'nanoflakes' shows promise for thermoelectric energy conversion.

Veeco achieves milestone with 100 automated MBE systems installed worldwide

03/27/2018  The installation of Veeco's GEN10 MBE System last month at Silanna Semiconductor PTY Ltd. in Australia marks this significant company milestone.

Semiconductor Industry Association issues statement on Trump administration Section 301 action on China

03/23/2018  The Semiconductor Industry Association (SIA) today released the following statement from President & CEO John Neuffer in response to the Section 301 action taken by the Trump Administration to address China's trade practices.

North American semiconductor equipment industry posts February 2018 billings

03/23/2018  February billings remain at a level indicating another positive year for semiconductor equipment spending.

U.S. companies maintain largest share of fabless company IC sales

03/23/2018  China-based companies show the largest fabless IC marketshare gain since 2010.

Mechanism and improvements of Cu voids under via bottom

03/22/2018  This work explores the effect of underlying metallic alloys and the influence of Cu loss under via bottom after dry etching and wet cleaning processes. To Improve the Cu loss under via bottom, effective approaches are proposed. The modified actions for via bottom improve not only wafer yield but also reliability of the device.

Electric textile lights a lamp when stretched

03/22/2018  Working up a sweat from carrying a heavy load? That is when the textile works at its best. Swedish researchers have developed a fabric that converts kinetic energy into electric power. The greater the load applied to the textile and the wetter it becomes the more electricity it generates.

"Technology, Circuits & Systems for Smart Living" theme for 2018 Symposia on VLSI Technology & Circuits

03/21/2018  Bringing together a technical program that encompasses 'big integration' of a number of critical industry trends -- machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing -- the 2018 Symposia on VLSI Technology & Circuits will showcase a convergence of technologies needed for 'smart living.'

RIT researchers improve fabrication process of nano-structures for electronic devices

03/21/2018  Use of indium gallium phosphide with I-MacEtch processing shows promise for more cost effective fabrication and increased performance in devices from photonics to telecommunications.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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