Wafer Processing

WAFER PROCESSING ARTICLES



Presto Engineering provides high-volume wafer-level test for Maja Systems wireless data-center connectivity solutions

03/06/2018  Launch of Maja Systems terabit connectivity solutions in millimeter wave CMOS accelerated by Presto’s high-volume wireless and RF test expertise.

SUNY Poly's Center for Semiconductor Research in Albany earns TÜV SÜD AMERICA INC. ISO 9001:2015 certification

03/06/2018  SUNY Polytechnic Institute today announced that its advanced semiconductor-based research and development efforts at its Albany NanoTech Complex have successfully received ISO 9001:2015 certification from TÜV SÜD AMERICA INC. for its effective quality management system.

Silvaco completes acquisition of NanGate

03/05/2018  Silvaco today announced that it has acquired NanGate, a developer of Electronic Design Automation (EDA) software, that offers tools and services for creation, optimization, characterization and validation of physical library IP.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

Understanding ALD, MLD and SAMs as they enter the fab

03/01/2018  As the world of advanced manufacturing enters the sub-nanometer scale era, it is clear that ALD, MLD and SAM represent viable options for delivering the required few-atoms-thick layers required with uniformity, conformality, and purity.

Semiconductor Manufacturing Electronics Corporation formally signed a joint venture agreement

03/01/2018  SMIC, Shaoxing Government, and Shengyang Group together announced today the founding of the Semiconductor Manufacturing Electronics (Shaoxing) Corporation (planned) with joint capital contributions. T

92 IC wafer fabs closed or repurposed from 2009-2017

03/01/2018  150mm and 200mm wafer fabs accounted for two-thirds of total closures.

Samsung Electronics breaks ground on new EUV line in Hwaseong

02/28/2018  Construction will be completed in the second half of 2019 and ready for production in 2020 Samsung aims to maintain its leadership in cutting-edge process technology under 7nm.

GLOBALFOUNDRIES strengthens 22FDX eMRAM platform with eVaderis' ultra-low power MCU reference design

02/27/2018  Co-developed technology solution enables significant power and die size reductions for IoT and wearable products.

Brewer Science announces new OptiLign DSA product family

02/27/2018  Brewer Science, Inc., today from SPIE Advanced Lithography 2018 introduced its OptiLign commercial-quality directed self-assembly (DSA) material set developed in collaboration with Arkema.

ClassOne Equipment selected to upgrade major UK fab

02/27/2018  ClassOne Equipment, Atlanta-based provider of refurbished name-brand semiconductor processing equipment, has announced the sale of multiple systems to a major global components manufacturer as part of a significant upgrade to their UK fab.

SILTECTRA's "twinning" breakthrough promises to vastly reduce wafering costs for manufacturers of silicon carbide-based IC devices

02/26/2018  SILTECTRA GmbH today reports that it has validated a breakthrough capability for its COLD SPLIT technology.

imec announces advances in EUV lithography

02/26/2018  Imec presents initial electrical results on N5 32nm pitch metal-2 layer.

North American semiconductor equipment industry posts January 2018 billings

02/23/2018  "The strong billings levels from late 2017 have carried over into the new year," said Ajit Manocha, president and CEO of SEMI.

Supermicro expands its Silicon Valley corporate headquarters

02/23/2018  Super Micro Computer, Inc. today announced that it has expanded its Silicon Valley Headquarters to over two million square feet of facilities with the grand opening of its new Building 22.

Peter Trefonas elected SPIE Fellow

02/22/2018  Peter Trefonas, Ph.D., corporate fellow in Dow Electronic Materials, has recently been elected a Fellow of SPIE, for achievements in design for manufacturing and compact modeling.

Entering 2018 on solid ground

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

Qualcomm enters into amended definitive agreement with NXP

02/20/2018  Qualcomm Incorporated today announced that Qualcomm River Holdings B.V. has reached an agreement with NXP Semiconductors N.V.

Top 10 semiconductor R&D spenders increase outlays 6% in 2017

02/20/2018  Intel far surpasses others with R&D spending of $13.1 billion in 2017 and accounts for 36% of expenditures among Top R&D spenders.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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