Wafer Processing

WAFER PROCESSING ARTICLES



Picosun provides 300mm ALD technology for green power electronics

01/16/2018  Picosun Oy, a supplier of Atomic Layer Deposition (ALD) thin film coating technology for global industries, partners with STMicroelectronics S.r.l. to develop the next generation 300mm production solutions for advanced power electronics.

Analog IC market forecast with strongest annual growth through 2022

01/12/2018  Power management, signal conversion, and automotive-specific analog markets drive expansion.

Worldwide semiconductor revenue grew 22.2% in 2017; Samsung takes over No. 1 position

01/11/2018  Worldwide semiconductor revenue totalled $419.7 billion in 2017, a 22.2 percent increase from 2016, according to preliminary results by Gartner, Inc. Undersupply helped drive 64 percent revenue growth in the memory market, which accounted for 31 percent of total semiconductor revenue in 2017.

Luc Van den hove to receive SEMI Sales and Marketing Excellence Award

01/11/2018  SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

Process Watch: The (automotive) problem with semiconductors

01/11/2018  This article is the first in a five-part series on semiconductors in the automotive industry. In this article, we introduce some of the challenges involved in the automotive supply chain. Future articles in the series will address specific process control solutions to those challenges.

Talent pipeline key to enabling industry growth: Takeaways from SEMI Member Forum

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

New oxide and semiconductor combination builds new device potential

01/10/2018  Researchers integrated oxide two-dimensional electron gases with gallium arsenide and paved the way toward new opto-electrical devices.

Xilinx appoints Victor Peng as president and CEO

01/05/2018  Xilinx, Inc. today announced that its board of directors has appointed Victor Peng as president and chief executive officer, effective January 29, 2018.

Fabless IC company sales top $100B for first time ever

01/04/2018  Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

Touchy nanotubes work better when clean

01/04/2018  Rice, Swansea scientists show that decontaminating nanotubes can simplify nanoscale devices.

Surprising changes in semiconductor equipment market share in 2017

01/04/2018  Through three quarters of calendar year 2017, market shares of top semiconductor equipment manufacturers indicate large gains by Tokyo Electron and Lam Research.

SEMI names new SEMI Japan president

01/02/2018  SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan.

UMC announces availability of 40nm SST embedded flash process

12/21/2017  Toshiba MCU ICs are expected to utilize the highly robust, non-volatile memory process.

New JEDEC committee for wide bandgap power semiconductors invites industry participation

12/20/2017  JEDEC Solid State Technology Association announces the successful launch of its newest committee: JC-70 Wide Bandgap Power Electronic Conversion Semiconductors.

ISS Europe 2018 to focus on winning in the global marketplace

12/20/2017  Electronics manufacturing executives will sharpen their competitive edge in Dublin, Ireland, on 4-6 March at Europe's SEMI Industry Strategy Symposium (ISS Europe).

Intersil to start operations as Renesas Electronics America in January 2018

12/19/2017  Renesas Electronics Corporation today announced the integration of Intersil Corporation as a legal entity and a new branding policy following the acquisition of Intersil on February 24, 2017.

EVG completes latest phase of production capacity expansion at corporate headquarters

12/19/2017  Newly opened building with advanced cleanroom technology provides additional space for final assembly of EVG process equipment and technical source inspection by the company's global customers.

Cypress appoints Jeannine Sargent to Board of Directors

12/18/2017  Cypress Semiconductor Corp. today announced the appointment of Jeannine Sargent to its board of directors.

Increase in the wafer size drives wafer mounter equipment market

12/15/2017  The global wafer mounter equipment market is expected to grow at a CAGR of more than 4% from 2017-2021, according to a new market research report by Technavio.

North American semiconductor equipment industry posts November 2017 billings

12/15/2017  North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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