12/14/2017  As part of this agreement, TMC and Western Digital will participate jointly in future rounds of investment in Fab 6, the memory fabrication facility now under construction at Yokkaichi, including the upcoming investment round announced by Toshiba in October 2017.

12/14/2017  QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, announced that it has collaborated with Mentor, a Siemens business, to provide a seamless design and development environment for its embedded FPGA (eFPGA) technology.

12/13/2017  The semiconductor industry has been there before, with large increases in investments followed by dramatic downturns. While the most dramatic downturns, 2001 and 2009, were due to, in a large part, acro-economic factors, the industry has typically observed one to two years of increased investment spending followed by a down period. This time around, the industry will achieve a “WOW” with three consecutive years of fab investment growth, a pattern not observed since the mid-1990s.

12/12/2017  ProPlus Design Solutions Inc. and MPI Corporation today announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus' SPICE modeling and noise characterization solution with MPI's advanced probing technologies.

12/12/2017  Dr. Yu selected for significant contributions to semiconductor-based devices, nanotechnology research after being awarded more than 300 U.S. patents.

12/12/2017  Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition.

12/08/2017  This new facility will be the primary manufacturing center for the Company’s wholly owned subsidiary, CVD Materials Corporation.

12/06/2017  Leti, a research institute of CEA Tech, has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow.

12/06/2017  EPFL researchers have successfully measured some of the quantum properties of electrons in two-dimensional semiconductors. This work in the field of spintronics could one day lead to chips that are not only smaller but that also generate less heat.

12/06/2017  A new technology enables dramatically lower thermal budget capability that is enabling to thermal processes like epitaxy, CVD and diffusion, without any semiconductor material consumption.

12/05/2017  Quarterly billings of US$14.3 billion set an all-time record for quarterly billings, exceeding the record level set in the second quarter of this year.

12/04/2017  The third quarter of this year has seen broad growth both globally and also for the European electronic supply chain.

12/04/2017  GLOBALFOUNDRIES and Ayar Labs, a startup bringing optical input/output (I/O) to silicon chips, today announced a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.

12/01/2017  Smartphones and computers wouldn't be nearly as useful without room for lots of apps, music and videos. Devices tend to store that information in two ways: through electric fields (think of a flash drive) or through magnetic fields (like a computer's spinning hard disk). Each method has advantages and disadvantages. However, in the future, our electronics could benefit from the best of each.

11/30/2017  The semiconductor industry continued its upward trend in the third quarter of 2017, notching 12 percent sequential growth with strength across all application markets, according to IHS Markit.

11/28/2017  North America-based manufacturers of semiconductor equipment posted $2.02 billion in billings worldwide in October 2017 (three-month average basis).

11/28/2017  China's first pure-wafer foundry selects SPTS's high productivity Omega plasma etch solution for production of GaN on SiC high power RF devices.

11/28/2017  Leti, a technology research institute of CEA Tech, announced that Emmanuel Sabonnadiere has been named CEO, succeeding Marie-Noelle Semeria.

11/17/2017  Cadence Design Systems, Inc. today announced that Anirudh Devgan, executive vice president and general manager of the Digital & Signoff Group and the System & Verification Group, has been appointed president of Cadence, effective immediately.

11/17/2017  Scientists invent technique to map energy and momentum of electrons beneath a material's surface.