01/16/2002  Jan. 16, 2002 - Tokyo, Japan - Worldwide orders for Japanese semiconductor manufacturing equipment fell for the 11th straight month in November.

01/11/2002  January 10, 2002 -- HONG KONG -- Technology giant Motorola Inc. announced today that will cut 1,200 to 1,300 chip manufacturing jobs in Austin, Texas, and Sendai, Japan, as part of a cost-cutting move to consolidate production at its other plants.

01/11/2002  Jan. 11, 2002 - Santa Clara, CA - Integrated Device Technology Inc. (IDT) will consolidate its wafer fab operations into the company's Hillsboro, OR manufacturing facility by 2H02.

01/10/2002  A new technology dubbed "resistive quartz" shows promise of providing advantages over conventional methods of heating fluids used in wafer processing without contaminating them. In addition, this technology is better able to handle changing process flow demands reliably.

01/10/2002  Jan. 10, 2002 - Schaumburg, IL - Motorola Inc. is set to cut 1,200 to 1,300 chip manufacturing jobs in Austin, TX, and Japan. The job cuts, to take place over nine to 15 months, are among the 4,000 semiconductor job cuts previously announced, spokeswoman Gloria Shiu said in Hong Kong.

01/10/2002  Jan. 10. 2002 - Utsunomiya, Japan - MEMC Electronic Materials Inc. has completed the transition of its center of excellence (COE) from a pilot line to a full-scale 300mm silicon manufacturing site.

01/09/2002  Jan. 9, 2002 - Santa Clara, CA - Intel Corp. has appointed 16 VPs. The newly appointed VPs are Craig Brown, Steven Grant, Nasser Grayeli, Ravi Jacob, Brian Krzanich, Jeffrey McCrea, Stuart Pann, Gregory Pearson, Prasad Rampalli, Keith Reese, Dianne Rudolph, Bruce Sewell, David Shannon, Anthony Sica, Stacy Smith, and Randy Wilhelm.

01/08/2002  Applied Materials recently introduced its decoupled plasma nitridation (DPN) chamber that incorporates a high concentration of nitrogen at the surface of an ultra-thin gate oxide, providing protection against leakage current and boron penetration. The process is single wafer.

01/04/2002  Jan. 4, 2002 - Taipei, Taiwan - United Microelectronics Corp. (UMC) said it may delay the start of mass production at its plant in Singapore.

01/03/2002  Toshiba Semiconductor's novel plan to rethink the fab to make small runs of systems chips without big capital investment may not be so far out after all.

01/02/2002  Jan. 2, 2002 - Salt Lake City, UT - Daw Technologies Inc., provider of ultra-clean manufacturing environments, has established a new subsidiary business unit, Daw Mexico, S. de R.L. de C.V. in Guadalajara, Mexico. The company has hired Jose de Jesus C?res G. to manage the new business unit.

01/01/2002  Strip packaging and wafer-level packaging (WLP) are now making packaging and final test more like fab processing

01/01/2002  Today's artificially intelligent systems are fabricated using sub-micron scale devices in micro- and meso-scale packages, primarily using electronic signals and the logic of programming to interface to the macroscopic world

01/01/2002  Modular/prefabricated cleanrooms isolate the process, whether it be manufacturing or laboratory related, from outside contamination. In addition to cleanliness, users can often control temperature and humidity, thereby ensuring the best possible results within the cleanroom.

12/27/2001  Dec. 27, 2001 - Armonk, NY - SEMX Corp. has signed a letter of intent to sell its domestic wafer reclaim operation, American Silicon Products, to an undisclosed party.

12/21/2001  December 21, 2001 -- SINGAPORE -- Chartered Semiconductor Manufacturing is buying into Semiconductor Manufacturing International Corp.

12/21/2001  Dec.21, 2001 - Milpitas, CA - Chartered Semiconductor Manufacturing and Semiconductor Manufacturing International Corporation (SMIC) have entered into an alliance. Upon execution of the detailed agreements, Chartered will transfer its 0.18-micron baseline logic process technology and grant patent license rights to SMIC in exchange for an equity stake and access to capacity.

12/21/2001  Dec. 21, 2001 - Hsinchu, Taiwan - Taiwan Semiconductor Manufacturing Company (TSMC) has appointed Dick Thurston VP and general counsel, effective January 2002.

12/20/2001  Dec. 20, 2001 - Taipei, Taiwan - Winbond Electronics Corp. is set to sell its five-inch wafer production lines to Asia Pacific MEMS System Corp. for NT$500 million (US$14.70 million).

12/20/2001  Dec. 20, 2001 - Burnaby, British Columbia - PMC-Sierra, a provider of broadband semiconductors, and Taiwan Semiconductor Manufacturing Company (TSMC) will collaborate on developing SoC products using 0.13-micron technologies.