Wafer Processing

WAFER PROCESSING ARTICLES



Chartered opens office in Nordic region

11/08/2001  November 8, 2001 - Singapore - Chartered Semiconductor Europe, a subsidiary of Chartered Semiconductor Manufacturing has opened an office in Stockholm, Sweden, to cover the Nordic market area.

Kulicke & Soffa, Amkor expand flip chip technologies license agreement

11/08/2001  November 8, 2001 - Willow Grove, PA & Chandler, AZ - Kulicke & Soffa Industries Inc. and Amkor Technology have expanded the 10-year technology transfer agreement between Amkor and Flip Chip Technologies, L.L.C. (FCT), a wholly-owned subsidiary of Kulicke & Soffa.

TSMC continues active investment

11/07/2001  November 7, 2001 - Hsinchu, Taiwan - Taiwan Semiconductor Manufacturing Co. Ltd. announced at a Tokyo press conference its plans for investments, a new plant, and new technology to be used, according to Asia Biz Tech.

Fab utilization totals hide big disparity among sectors

11/07/2001  Despite those dismal fab utilization totals, there's one sector of the industry that's still running at surprisingly close to full capacity - Taiwan's DRAM makers.

SEMI reports 3Q silicon wafer shipments

11/07/2001  November 7, 2001 - San Jose, CA - Worldwide silicon wafer area shipments declined 17% during 3Q01 compared to the previous quarter, according to what Semiconductor Equipment and Materials International (SEMI) reported in its quarterly analysis of the silicon wafer industry.

A move to single wafer cleaning

11/06/2001  One of the biggest trends in wafer cleaning today is single wafer wet cleans at the critical pre-gate level. Strictly speaking, PVA brushes (scrubbers) used in post-CMP cleans can be considered a single wafer cleaning process, and some fabs use single wafer etching for backside thinning and layer removal.

Electroglas launches new software division

11/06/2001  November 6, 2001 - San Jose, CA - Electroglas Inc. has formed a new software division, EG Soft, that is entering the market with an integrated portfolio of software products to help semiconductor manufacturers improve throughput and yield.

JMAR awarded broad patent for X-ray lithography process

11/02/2001  November 2, 2001 - San Diego, CA - JMAR Technologies Inc. a provider of precision micro- and nanotechnology products, said its JMAR-SAL NanoLithography Inc. (JSAL) division, Burlington, VT, has been awarded US patent number 6,295,332, titled Method for Improving X-ray Lithography in the Sub-100nm Range to Create High Quality Semiconductor Devices.

SpeedFam-IPEC to reduce headcount

11/02/2001  November 2, 2001 - Chandler, AZ - SpeedFam-IPEC Inc. has announced cost-cutting measures that include decreases in discretionary spending and a reduction in worldwide headcount by 20%, or approximately 160 employees, as part of its continued commitment to reducing operating costs.

Implant Center and Ion Implant Services join forces

11/01/2001  November 1, 2001 - San Jose, CA - Implant Center Inc. (IC) and Ion Implant Services Inc. (IIS), two providers of ion implantation services, have joined forces and have adopted a new name for the combined operation, INNOViON Corp.

European technologists to combine Cu/low-k, packaging

11/01/2001  Belgium's independent R&D center IMEC has begun research to develop technology that will give the industry integrated wafer-level packaging on copper low-k IC interconnect, to be done in wafer processing's back end of the line (BEOL).

Winbond adopts new strategy to cope with business slowdown

11/01/2001  November 1, 2001 - Taipei, Taiwan - The board of Winbond Electronics Corp. yesterday decided to revamp its business strategies and restructure to cope with the economic slowdown.

Process integration of electroplated solder bumps for WLP

11/01/2001  Providing high density and performance for chip-to-system interconnection

The back-end process: Step 11 - Scribe and break

11/01/2001  Die separation of thin silicon wafers and delicate III-V substrates creates challenges for traditional saw dicing

Finally, a little good news

11/01/2001  According to the September 2001 update to IC Insight's (Scottsdale, AZ) McClean Report, the integrated circuit (IC) recovery of 2001 (Fig. 2) will most certainly mirror that "canoe" shape, or rolling bottom...

TSMC invests T$7.5B in R&D project

10/30/2001  October 30, 2001 - Taiwan - Taiwan Semiconductor Manufacturing Co Ltd. (TSMC), has invested T$7.7 billion in R&D of the 0.13-micron manufacturing process for 300mm chipsets in the first three quarters of 2001.

AMAT teams with PDF Solutions to boost chipmaker yield

10/30/2001  October 30, 2001 - Santa Clara, CA - Applied Materials Inc. and PDF Solutions have announced a collaboration to provide comprehensive yield improvement solutions to semiconductor manufacturers. The program combines Applied Materials' inspection and methodical defect reduction technology with PDF Solutions' process-design characterization methodologies.

NIST grant goes to develop internet-based security framework

10/30/2001  October 30, 2001 - Austin, TX - domainLogix Corporation, Advanced Micro Devices, ILS Technology, and Oceana Sensor Technologies will develop a set of security reference models to be used as a basis for research within the semiconductor manufacturing and tool supplier industries.

CMP users look at test technology, reducing COO

10/29/2001  The annual CMP Users' Group symposium (Northern California chapter of the American Vacuum Society) held recently in San Jose was rich with new technologies and industry progress. Although the CMP market projections presented by Tom Tucker of Laredo Technologies were grim - second half revenues are expected to be down 50% from 1H01 - he did highlight several technologies that will come to the fore as the industry scrambles to innovate its way out of the downturn.

TSMC announces $20B expansion program

10/29/2001  October 29, 2001 - Tainan, Taiwan - Taiwan Semiconductor Manufacturing Co. (TSMC) has announced a new NT$700 billion (US$20 billion) expansion plan, which includes six new 300mm fabs in Taiwan.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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