Wafer Processing

WAFER PROCESSING ARTICLES



UMC revises 2001 financial forecast

10/08/2001  October 8, 2001 - Taipei, Taiwan - United Microelectronics Corporation (UMC) has revised its annual financial forecast for 2001.

SEMI urges congress to support economic stimulus package provisions

10/05/2001  October 5, 2001 - Washington, DC - Semiconductor Equipment and Materials International (SEMI) called on Congress to support accelerated depreciation for high-tech manufacturing equipment as part of the economic stimulus package announced by President Bush this week.

Japan chipmakers put operations on hold

10/03/2001  October 3, 2001 - Tokyo, Japan - Fujitsu and NEC, two of Japan's five chipmaking companies said they are temporarily idling a number of semiconductor plants in Japan as they confront a record chip market downturn.

SEMI looks to get all of industry on same (dictionary) page

10/02/2001  Does CMP stand for Can't Make it Polish? Is ASP a venomous snake? When is a semiconductor not an IC? With all the gobbledygook in the semiconductor industry, it's easy to see why even people who've been in the business since Moses was a process engineer can be easily confused.

Applied Materials, Intel enter FAB300 software collaboration, licensing agreement

10/02/2001  October 2, 2001 - Santa Clara, CA - Applied Materials Inc. is signing a multi-year collaboration and licensing agreement for its FAB300 MES (manufacturing execution system) software with Intel.

Mentor Graphics launches new test technology

10/02/2001  October 2, 2001 - Wilsonville, OR - Mentor Graphics Corp. announced new patent pending Design-for-Test technology called Embedded Deterministic Test (EDT) that extends the capacity of automatic test equipment for a reduction in the cost of semiconductor testing, which can represent as much as 50% of manufacturing costs.

SOITEC appoints industry veteran as new chief scientist

10/02/2001  October 2, 2001 - Peabody, MA - SOITEC, a manufacturer of silicon-on-insulator (SOI) wafers for use in semiconductor manufacturing, today announced the appointment of 25-year industry veteran George Celler to the newly created position of chief scientist.

Back-end assembly: Closing the traceability gap

10/01/2001  In semiconductor manufacturing, the high value of semiconductor wafers has traditionally placed a heightened emphasis on wafer traceability - the ability to automatically track a wafer through the fabrication process

Two cleanroom fire safety protocols accepted by NFPA 318

10/01/2001  QUINCY, MA—The National Fire Protection Association (NFPA) committee 318 recently adopted two protocols for testing non-fire propagating materials used to manufacture cleanroom tools and equipment—Factory Mutual Research 4910 Protocol and Undewriter's Laboratories (UL) 2360.

Tokyo Seimitsu rejects patent claim, files antitrust counterclaim against KLA-Tencor

09/27/2001  September 27, 2001 - Oakland, CA - Today, Tokyo Seimitsu Co., Ltd. has filed its answer in response to KLA-Tencor's patent infringement suit. The answer denies all charges of patent infringement and alleges KLA's U S Patent No. 4,805,123 is invalid and unenforceable.

PRI Automation to continue support of Compaq's future Itanium-based openVMS platform

09/21/2001  September 21, 2001 - Billerica, MA - PRI Automation, Inc. (PRI), will continue its use of Compaq Computer Corporation's OpenVMS platform.

IBM to sell Japanese electronic parts plant to SCI

09/18/2001  September 18, 2001 - Armonk, NY - IBM Corp. is in the final stages of negotiations with SCI Systems Inc., a US electronics manufacturing services (EMS) firm, to sell its Japanese unit's electronic parts factory, sources close to the matter said.

Analog Technology broken into 2 business divisions

09/17/2001  September 17, 2001 - Taipei, Taiwan - Analog Technology Inc., a manufacturer of various ICs, has split into two business divisions, one for IC products and the other for providing wafer foundry services, beginning this month.

Aset to work on low cost, low throughput tools

09/13/2001  A wafer fab built with current equipment has to have capacity of 20,000 wafers or so a month to be economical. New minifabs would run only 5,000 wafers per month, with smaller, lower throughput equipment, but the key is reducing tool costs proportionally as well.

Asyst and TSMC team 300mm automation solution

09/11/2001  September 11, 2001 - Fremont, CA - Asyst Technologies Inc. is collaborating with Taiwan Semiconductor Manufacturing Co. (TSMC) on a strategic 300mm fab-transport development project.

Intel Plans New 300 mm Wafer Fab Plant

09/06/2001  September 6, 2001 -- HOUSTON, CO -- Despite the current high-tech downturn, Intel plans to break ground in October on a new one million square foot 300 mm wafer fab plant in Hillsboro, Oregon.

SEZ opens new service center to support growing German client base

09/05/2001  September 5, 2001 - Villach, Austria - The SEZ Group has opened its newest service and support center in Dresden, Germany. The location is of strategic importance for SEZ because it will be the primary source of support for the company's installed tool base in the growing high-tech community in the Dresden area (Silicon Saxony).

KLA-Tencor to Buy QC Optics

09/04/2001  September 4, 2001 -- WILMINGTON, MA -- San Jose-based KLA-Tencor plans to buy defect detection system manufacturer QC Optics.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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