Wafer Processing

WAFER PROCESSING ARTICLES



More Chip Companies to Cut Jobs

04/13/2001  April 13, 2001 -- More companies are resorting to job cuts, citing a downturn in the semiconductor market.

Sony Hits Zero Emissions Mark At Six Chip Plants

04/12/2001  April 12, 2001 -- TOKYO -- Sony Corp. has achieved zero emissions for waste from six of its chip making plants.

Axcelis unveils ion implant control system

04/12/2001  April 12, 2001 - Beverly, MA - Axcelis Technologies has introduced a next-generation control system that, according to the company, allows greater productivity and throughput for new and installed ion implanters.

Legal warning to TSMC from UMC

04/11/2001  April 11, 2001 - Taipei - United Microelectronics Corp. has warned Taiwan Semiconductor Manufacturing that it may face legal action if it accepts orders from Silicon Integrated Systems Corp. (SIS).

FSA releases its 2001 Wafer and Packaging Demand Survey

04/09/2001  April 9, 2001 - San Jose, CA - The Fabless Semiconductor Association has released the results of its 2001 Wafer and Packaging Demand Survey in which 111 fabless companies participated.

Austin Area Semiconductor Executive Council Launches Eye-Opening Initiative

04/09/2001  April 9, 2001 -- AUSTIN, TX -- A new initiative aimed at creating more opportunities for those looking to get into the high tech field has been launched by the Austin Area Semiconductor Executive Council.

Bumping technology

04/01/2001  Addressing industrial issues is key

In the news

04/01/2001  Unitive announces venture in Taiwan

TSMC's 0.15-micron technology in volume production

03/26/2001  Taiwan Semiconductor Manufacturing Company (TSMC), has successfully ramped 0.15-micron processes to full production status.

CODEON Launches Production of High-Speed Optical Modulators for Fiber Optic Networks

03/20/2001  March 20, 2001 -- ANAHEIM, CA -- CODEON Corporation, a leading designer and manufacturer of state-of-the-art optical components for the fiber optic telecommunications industry, has begun shipping its high-speed, lithium-niobate optical modulators.

Taiwan makers' chip sales drop sharply in February

03/20/2001  Things got worse fast in Taiwan in last month. Sales at Taiwan Semiconductor Manufacturing Co., Ltd, dropped 28% in February from January?s level, while those of United Microelectronics Corp. fell 21%, according to Daiwa Securities Senior Analyst Yasuo Nakane, in his regular report for Nikkei Microdevices.

Intel puts Hudson project on ice, chip industry cools off

03/16/2001  March 16, 2001 -- A week after laying off 5,000 people company wide, Intel Corp. has put its multimillion dollar expansion project for its Hudson, MA, facility on indefinite hold.

Diodes Inc. Comments on First-Quarter Outlook

03/15/2001  MArch 15, 2001 -- WESTLAKE VILLAGE, CA -- Diodes Inc.said that net income for the first quarter of 2001 will be lower than previously expected due to continuing softness in demand, particularly in the computing and communications sectors.

Kimball International opens microelectronics facility in California

03/14/2001  March 14, 2001--Jasper, Indiana--Kimball International, Inc. today announced the opening of its new 40,000-sq.-ft. microelectronics facility in Valencia, CA. As Kimball Electronics Group's (KEG) Microelectronics Center of Excellence, the facility will support wafer and die processing, design and manufacturing of standard and custom monolithic devices, multi-chip modules (MCM's), chip-on-board (COB), and surface mount (SMT) assemblies.

Patent awarded to NuTool for copper deposition technology

03/14/2001  March 14, 2001--Milpitas, California--NuTool, Inc. has been granted a U.S. patent covering a process for depositing interconnect material in submicron structures of an IC, creating a planar film while preventing unwanted accumulation of the film on the wafer's surface. The first application is for copper interconnect, the new material in use for the most advanced ICs.

Thomas West increases capacity, expands manufacturing space

03/14/2001  March 14, 2001--Sunnyvale, California--Thomas West Inc. (TWI) today announced a major capital expansion and upgrade of its applications lab and manufacturing facilities as part of an ongoing investment to provide its customers with the most advanced CMP materials and technology for semiconductor manufacturing. The increased capacity and expansion is in direct response to increased customer demand for the company's advanced CMP pads.

SST enters technology licensing, deep submicron foundry agreement with Oki

03/14/2001  March 14, 2001--Sunnyvale, California--Silicon Storage Technology, Inc. (SST), a leader in flash memory technology, is entering into a multifaceted technology licensing and deep submicron foundry agreement with Oki Electric Industry Co. Ltd., a worldwide supplier of semiconductor products.

Microsemi receives patent for microwave flip chip technology

03/14/2001  March 14, 2001--Santa Ana, California--Microsemi Corp. has received a patent for its breakthrough Monolithic Microwave Surface Mount semiconductor packaging technology that eliminates costly ceramic and metal packages commonly used for components operating at frequencies up to 12 GHz in high-speed microwave applications.

SST lowers first quarter outlook

03/12/2001  March 12, 2001--Sunnyvale, California--Silicon Storage Technology, Inc. (SST) announced today that revenue, product gross margin,and earnings per share for the first quarter of 2001 will be significantly lower than previously expected, due to the deteriorating economy and inventory corrections that are continuing to constrain demand for technology products.

Diodes Inc. lowers income expectations, reduces workforce

03/12/2001  March 12, 2001--Westlake Village, Callifornia--Diodes Inc. reports that net income for the first quarter of 2001 will be lower than previously expected, and that the company intends to reduce its worldwide workforce by 26%--primarily at the FabTech and Diodes-China manufacturing facilities.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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