Wafer Processing

WAFER PROCESSING ARTICLES



TSMC's February sales show slight decrease from January

03/12/2001  March 12, 2001--Hsinchu, Taiwan--Taiwan Semiconductor Manufacturing Co. (TSMC) recently announced that net sales for February 2001 totaled NT$11,614 million, representing an increase of approximately 28.8% over February 2000 sales and a decrease of 28.0% from January 2001 sales. The company's sales revenue for January and February 2001 totaled NT$27,771 million, representing an increase of 51.4% over the corresponding period of 2000.

Sony, IBM, Toshiba to jointly develop 'supercomputer-on-a-chip'

03/12/2001  March 12, 2001--Tokyo, Japan--Sony Computer Entertainment Inc. (SCEI), IBM Corp., and Toshiba Corp. today announced plans to collectively invest more than $400 million over the next 5 years to research and develop an advanced chip architecture for a new wave of devices in the emerging broadband era.

TSMC to decommission its Fab 1

03/09/2001  March 9, 2001--Hsinchu, Taiwan--Taiwan Semiconductor Manufacturing Co. (TSMC) today announced plans to decommission its Fab 1 on the Chung Hsing Compound at Taiwan's Industrial Technology Research Institute on March 31, 2002, following a phased decommissioning plan.

Chartered, Virage team to provide enhanced performance in memory-rich chip designs

03/08/2001  March 8, 2001--Fremont, California--Chartered Semiconductor Manufacturing and Virage Logic Corp. have announced efforts to develop Virage Logic's Custom-Touch ASAP embedded memory compilers for Chartered's all-copper, low-k dielectric, 0.13-micron 'communications-smart' manufacturing process.

No clear winner in battle between DDR DRAM and RDRAM this year, analysts predict

03/08/2001  March 8, 2001--San Jose, California--The critical battle for the future of DRAM technology is being waged in the PC memory arena between DDR DRAM and RDRAM, but San Jose, CA-based market research firm Gartner Dataquest cautions not to expect to see an end to the dispute this year.

Amkor plans to acquire two semiconductor assembly and test companies in Taiwan

03/08/2001  March 8, 2001--Chandler, Arizona--Amkor Technology is continuing the momentum of its growth strategy in Asia by acquiring two established semiconductor assembly and test companies in Taiwan, enabling the company's rapid entry into that nation's growing semiconductor industry.

Granite offers high stability for Suss' probers

03/07/2001  March 7, 2001--Munich, Germany--Karl Suss recently added high stability wafer probe systems to its existing product portfolio. The platform, made of granite, enhances Suss' submicron probing range capabilities because it makes the probers less sensitive to undesirable environmental influences such as noise and does not pick the vibrations up as much as aluminum and other metals.

KLA-Tencor unveils 'Precice'

03/07/2001  March 7, 2001--San Jose, California--KLA-Tencor Corp. has introduced Precice, a production-worthy in-situ film thickness and end-point control system for copper CMP.

Amkor revises first quarter guidance

03/07/2001  March 7, 2001--Chandler, Arizona--Amkor Technology, Inc., announced that as a result of prolonged weakness in first-quarter business conditions, the company presently expects first quarter 2001 revenues to be below the guidance level given on January 31, 2001.

Spinning wafer coatings at zero G

03/07/2001  March 7, 2001--Albuquerque, New Mexico--The U.S. Department of Energy's Sandia National Laboratory has launched an experiment to discover whether a viscous coating can be deposited in zero gravity on a spinning silicon wafer more smoothly than possible on Earth.

RosettaNet extends global e-business outlook to China's leading high-tech companies

03/07/2001  March 7, 2001--Santa Ana, California--A delegation led by RosettaNet CEO Jennifer Hamilton this week visited Beijing, China, to augment the organization's ongoing dialogue and activities in the region.

Tower Semiconductor Receives $46 Million Second Investment Installment

03/07/2001  March 7, 2001 -- MIGDAL HAEMEK, Israel -- Tower Semiconductor recently announced the receipt of the second aggregate equity investment installment of the$305 million investment committed to by Tower's equity partners.

ASE licenses K&S technology to produce advanced copper wafer BGA packages

03/06/2001  March 6, 2001--Willow Grove, Pennsylvania--Kulicke & Soffa Industries Inc. (K&S) announced today that Advanced Semiconductor Engineering Inc. (ASE) has signed an agreement to purchase a technology license and specialized equipment for K&S's proprietary OP2 Oxidation Prevention Process, which is used to manufacture copper ICs.

PerkinElmer acquires Applied Surface Technology

03/02/2001  March 2, 2001--Boston, Massachusetts--PerkinElmer, Inc. announced today that it has acquired Applied Surface Technology (AST), a provider of proprietary processing techniques and services applied in semiconductor wafer fabrication equipment. Located in San Carlos, CA, AST's annual revenue is approximately $7 million.

TSMC To Build New 12-inch Wafer Plants

03/02/2001  March 2, 2001 -- TAIPEI -- Taiwan Semiconductor Manufacturing Co. plans to construct four more 12-inch wafer plants over the next few years in order to meet a projected demand.

Chartered provides new earnings guidance

03/01/2001  March 1, 2001--Milpitas, California--Chartered Semiconductor Manufacturing recently announced that due to the weakening economic environment and market conditions, revenues and earnings for the company's first quarter will be below its earlier guidance.

DNA: The crystal ball

03/01/2001  Situated in the shadows of Scotland's Edinburgh Castle is The Roslin Institute, the birthplace of the famous cloned sheep, Dolly, and the site where human monoclonal antibodies for melanoma and other cancers are produced inside the eggs of genetically modified chickens.

From dicing to packing: Examining the packaging process

03/01/2001  Despite the many advances in assembly manufacturing since the IC was invented, the basic process has not changed significantly

C4 makes way for electroplated bumps

03/01/2001  Until recently, controlled collapse chip connection bump technology, developed in the late 1960s, provided a reliable interconnect for high-performance, leading-edge microprocessors

Euro Particles

03/01/2001  England...France...Germany...




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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