10/12/2017  Novel two-dimensional, metal organic hybrids efficiently move charge, eventually storing renewable energy.

10/11/2017  The semiconductor IP market is expected to be valued at USD 6.22 billion by 2023, at a CAGR of 4.87% between 2017 and 2023.

10/11/2017  According to Yole Développement (Yole), the laser equipment market will grow at a 15% CAGR between 2016 and 2022 and should reach more than US$4 billion by 2022.

10/10/2017  ON Semiconductor agrees to purchase 30 percent incremental share of Fujitsu’s 8-inch wafer fab in Aizu-Wakamatsu, Japan, resulting in 40 percent ownership with plans to increase to 60 percent by the second half of 2018 and full ownership in the first half of 2020.

10/09/2017  EV Group (EVG) and SwissLitho AG today announced a joint solution to enable the production of 3D structures down to the single-nanometer scale.

10/06/2017  This prestigious award recognizes NXP for Excellence in Quality for displaying the highest quality standards, practices, and methodologies in their products and processes, and differentiating through their quality management systems and alignment to Cisco’s strategies and values.

10/04/2017  Worldwide sales up 24 percent year-to-year and 4 percent month-to-month; Americas market leads the way with growth of 39 percent year-to-year and 9 percent month-to month.

10/03/2017  Today, SEMI announced the lineup of keynotes coming to SEMICON Japan's "SuperTHEATER" -- focusing on the future of the electronics manufacturing supply chain.

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

09/29/2017  The Semiconductor Industry Association (SIA) released the following statement today from SIA president & CEO John Neuffer in support of the corporate tax reform framework released today by leaders in the Trump Administration and Congress.

09/29/2017  EPFL scientists have now greatly improved the operational stability of PSCs, retaining more than 95% of their initial efficiencies of over 20 % under full sunlight illumination at 60oC for more than 1000 hours.

09/28/2017  OEM Group announced today a post-dice clean solution on the proven Cintillio Batch Spray platform following plasma and laser dicing methods.

09/28/2017  The patent, the first ever for a thin III-V layer on crystalline silicon thin-film, covers group III-V elements such as Gallium Arsenide (GaAs), and Indium Gallium Phosphide (InGaP), for the top layer, as well as all inorganic materials, including, silicon, germanium, etc., for the bottom layer.

09/28/2017  UCSB engineers create atomically thin superlattice materials with precision.

09/27/2017  Reno Sub-Systems today announced it has closed its Series C funding.

09/26/2017  Understanding the impact of valve flow coefficient (Cv) in fluid systems for microelectronics manufacturing.

09/26/2017  Last year was a great year for photovoltaic (PV) technology.

09/25/2017  A new system combines acoustic, optical and reflectometric techniques to enable measurement of metals, dielectrics, resists and critical dimensions on a single platform.

09/25/2017  Synopsys, Inc. today announced that the Synopsys Design Platform has been fully certified for use on Samsung Foundry's 28FDS (FD-SOI) process technology.

09/22/2017  DSA and EUV should be envisioned as complementary, not competing, techniques that will eventually become mainstream for fine-pitch lithography.