Wafer Processing

WAFER PROCESSING ARTICLES



Sony To Build 300 MM Facility in Japan

08/31/2000  TOKYO -- August 31, 2000 -- Japan's electronics giant Sony Corp. said it will spend $943 million over the next five years building its first 300-mm wafer fabrication facility.

Motorola Chooses IPC Solution to Improve Oxide CMP Processes

08/29/2000  REHOVOTH, Israel?Aug. 29, 2000?In an effort to improve its wafer manufacturing efficiency, Motorola has placed multiple orders for Nova Measuring Instrument's NovaScan Integrated Thickness Monitoring (ITM) systems.

Chartered and Ricoh Extend Pact

08/25/2000  SINGAPORE--Aug. 24, 2000--Chartered Semiconductor Manufacturing and Ricoh Company, Ltd. have announced an extension of their current manufacturing relationship.

SmartLynx Links Analog and Mixed Signal Chip Design Tools

08/25/2000  LONDONDERRY, N.H.--Aug. 25, 2000--SmartLynx Inc. announced new integration solutions that the company said provide bi-directional, intelligent data transfer for EDA tools.

Ametek Debuts Oxygen Analyzer for RTP

08/24/2000  PAOLI, Penn.--Aug. 24, 2000--Ametek, Inc. has developed an oxygen analyzer for rapid thermal processing silicon wafer fabrication systems.

Dialog, Chartered Ink Three-Year Manufacturing Agreement

08/23/2000  STUTTGART, Germany and SINGAPORE--Aug. 23, 2000--A three-year manufacturing agreement potentially worth $250 million has been signed by Dialog Semiconductor and Chartered Semiconductor Manufacturing.

TSMC Orders Web Content Management, Implanters

08/22/2000  TAINAN, Taiwan--Aug. 22, 2000--Taiwan Semiconductor Manufacturing Company (TSMC), said they have selected Interwoven TeamSite/BroadVision Edition as their Web content management solution. In addition, the chip giant has ordered 300-mm high- and medium-current implanters from Varian Semiconductor Equipment Associates.

Tower Semiconductor Inks Pact with M+W Zander AG for New Fab

08/22/2000  MIGDAL HAEMEK, Israel--Aug. 22, 2000--Pending government approval, Tower Semiconductor Ltd. will embark on the construction of a new wafer fabrication plant valued at over $200 million.

Research Firm Warns of Slowdown

08/21/2000  CUPERTINO, Calif.--Aug. 21, 2000--While semiconductor sales post record high numbers and bookings of semiconductor manufacturing equipment are at robust levels, a slowdown could be right around the corner, warns Advanced Forecasting, Inc. (AFI), a research firm for the semiconductor and related industries.

China Approves Motorola's Semiconductor, Telecommunication Manufacturing Plans

08/21/2000  BEIJING, China and AUSTIN, Texas--Aug. 21, 2000--After months of waiting and a premature announcement in July, Motorola has finally received approval for its planned 16B RMB (US$1.9 billion) investment in new semiconductor manufacturing and telecommunications facilities.

SEMATECH to Evaluate Metrology Tools

08/18/2000  AUSTIN, Texas--Aug. 18, 2000--Research consortium International SEMATECH today announced the launch of a Metrology/Yield Management Tool Initiative to develop and evaluate new measurement technologies for advanced semiconductor manufacturing processes.

Synopsys, TSMC to Develop Test Chips

08/17/2000  MOUNTAIN VIEW, Calif.--Aug. 17, 2000-Synopsys Inc. and Taiwan Semiconductor Manufacturing Corp. announced an agreement to jointly develop test chips and silicon-calibrated technology files.

Bio-Rad Laboratories Leaves Semiconductor Measurement Business

08/06/2000  HERCULES, Calif.--Aug. 4, 2000--Bio-Rad Laboratories has sold its semiconductor measurements business to Accent Semiconductor Technologies.

Kulicke & Soffa Shares Plunge on Order Deferrals

08/04/2000  WILLOW GROVE, Pa.--August 3, 2000--Kulicke & Soffa Industries, a supplier of bonding equipment for the semiconductor industry, saw its share prices plunge 25% yesterday after it announced some customer order deferrals and push-outs for its 8028 ball bonders.

Companies Complete Flip Chip Technology Transfer

08/03/2000  KAOHSIUNG, Taiwan--August 2, 2000--Advanced Semiconductor Engineering flip chip factory has received wafer bumping and redistribution technology from Kulicke & Soffa Industries and Flip Chip Technologies.

Outsourcing packaging engineering: The key to the ticking clock

08/01/2000  Time-to-market is indisputably the key issue facing the semiconductor industry. In the midst of the Internet revolution, opportunities abound for those semiconductor companies that can provide rapid solutions to these new-world demands

Particles...

08/01/2000  Cleanroom takes aim at Listeria; Taiwan chipmakers report little damage from quake; Wilshire Technologies signs definitive agreement of sale with Foamex Asia ...

Consortia Release English Version of 300mm Performance Metrics for 0.13-micron Processing

07/28/2000  PARIS, France--July 28, 2000--Building on their previous cooperation on 300mm wafer manufacturing requirements, International SEMATECH and the Japanese consortium Selete have made available the English language version of its 300mm equipment performance metrics for 0.13 ?m technology document.

TSMC Equips 300mm Pilot Line with Applied Materials Systems

07/27/2000  SANTA CLARA, Calif.--July 26, 2000--Applied Materials Inc. announced that TSMC has placed a volume purchase order for its 300mm semiconductor manufacturing systems. Applied is now shipping systems to TSMC's Fab 6 located in Tainan, Taiwan.

Epi Wafer Monitoring Tool Promises Zero Scrap

07/24/2000  BILLERICA, Mass.--July 21, 2000--Promising users significant savings in cost and time due to its easy integration into the wafer production process, SemiTest Inc. has introduced the Epimet Model 2, an upgraded epitaxial resistivity monitoring tool.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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