Wafer Processing

WAFER PROCESSING ARTICLES



Avant! Granted Optical Proximity Correction Patent

07/20/2000  FREMONT, Calif.--July 20, 2000--Avant! Corporation was awarded patent number 6,081,658 for their Proximity Correction System for wafer lithography.

Semitool to Include Royal Phillips Metrology In Deposition Products

07/17/2000  SEMICON West '00--July 14,2000--Semitool's Paragon line of electrochemical deposition tools will include Royal Phillips Electronics new integrated metal-film metrology system, say the companies.

Compaq and Camstar Debut Semiconductor Manufacturing System

07/11/2000  CAMPBELL, Calif.--July 11, 2000--Compaq Computer Corporation and Camstar Systems, Inc. announced the release of a computer integrated manufacturing solution for semiconductor test, assembly and packaging.

Adept FFE 200/300mm Front-End Systems Combine Wafer Sorting & SMIF Loading

07/10/2000  SEMICON West '00--July 10, 2000--Announced today in San Francisco, Calif., Adept's new Flexible Front-End Systems for 200mm and 300mm are described as combining wafer sorting and SMIF loading into one system.

August Introduces High-Speed Wafer Defect Detection Tools

07/10/2000  SEMICON West '00--July 10, 2000--At SEMICON West, August Technology today introduced two high-speed wafer inspection systems for defects down to 0.5 ?m.

Semitool Unveils Enhanced Wafer Cleaning System

07/10/2000  SEMICON West '00--July 10, 2000--Making its debut today in San Francisco, Calif., the Spectrum E automated modular batch wafer cleaning system from Semitool Inc. is the latest version of the company's Spectrum advanced surface preparation system.

Nova Measuring Instruments to Introduce Photolithography Tools

07/07/2000  SAN FRANCISCO, Calif.--July 7, 2000--Nova Measuring Instruments Ltd. will introduce a new dual-purpose integrated process control system for overlay registration measurement and full wafer macro defect inspection for photolithography manufacturing at the Semicon West show.

Motorola Semiconductor Triples Capacity, Completes 6-Inch Conversion of GaAs Fab

07/07/2000  PHOENIX, AZ--July 6, 2000--Completing the process three months ahead of time, Motorola's Semiconductor Products Sector has converted its Compound Semiconductor-1 (CS-1) Gallium Arsenide (GaAs) wafer fab facility from 4- to 6-inch wafers. The conversion triples the company's capacity.

Tower Semiconductor to Build New 8-Inch Fab

07/05/2000  MIGDAL HAEMEK, Israel--July 5, 2000--Israeli foundry company Tower Semiconductor Ltd. has announced plans to build a new 8-inch wafer fab later this year with the help of a $75 million investment from SanDisk.

Infineon to Build New Fab in Virginia

06/30/2000  SAN JOSE, Calif.--June 30, 2000--In addition to building 300-mm wafer fabs in Germany and Taiwan, Infineon Technologies said today that a new stateside facility could also eventually produce 300-mm wafers.

LSI Logic Outsources Ion Implantation

06/27/2000  GRESHAM, OR--June 22,2000--LSI Logic will outsource ion implantation services to Implant Center to support its Gresham, Oregon wafer fab facility.

Intel To Build $2 Billion Fab In Ireland

06/20/2000  LEIXLIP, Ireland--June 19, 2000--Intel Corp. announced plans today to spend $2 billion adding a new wafer fabrication facility at its manufacturing operations in Leixlip, County Kildare, Ireland.

Applied Announces 0.10-Micron Wafer Inspection Tools

06/20/2000  SANTA CLARA, Calif.,--June 19, 2000--Applied Materials today announced a pair of tools capable of monitoring volume production processes at 0.10 ?m device sizes.

Silterra Purchases Electroglas Wafer Probers

06/14/2000  SAN JOSE, Calif.--June 14, 2000--Electroglas Inc. a supplier of process management tools for the semiconductor industry, today announced the purchase by Silterra Malaysia of multiple 4090u wafer probers.

JDS Uniphase to Purchase Motorola facility for MEMS Expansion

06/14/2000  SAN JOSE, Calif.--June 14, 2000--JDS Uniphase Corp. announced a definitive agreement to purchase a North Carolina facility to expand its Cronos MEMS manufacturing capacity.

Chartered Tests MIPS Drop-In Processor Cores

06/06/2000  YOKOHAMA, Japan--June 6, 2000--MIPS Technologies and Chartered Semiconductor Manufacturing have completed the testing necessary to allow customers to use "drop-in" MIPS intellectual property processor cores directly through Chartered's foundries.

What you see is what you get

06/01/2000  Finding patterns and reporting their location quickly and accurately is essential in today's high-precision electronics and semiconductor manufacturing environments.

Stacked multi-chip CSP standards

06/01/2000  JEDEC has propelled stacked chip-scale package standardization efforts in the form of a common agreement on SRAM and flash chips in a single package.

Partners in Manufacturing: Increasing performance and speed with wafer bumping

06/01/2000  Wafer-level processing provides effective solutions to demanding requirements.

Novellus Lands Order from Malaysian Foundry

05/31/2000  SAN JOSE, Calif.--May 30, 2000--1st Silicon has purchased multiple SPEED high density plasma chemical vapor deposition tools from Novellus Systems.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts