09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

09/21/2017  GF worked closely with Synopsys to complete the rigorous certification process of the Synopsys Design Platform on our 22FDX process platform.

09/21/2017  A study led by UChicago researchers describes an innovative method to make stacks of semiconductors just a few atoms thick. The technique offers scientists and engineers a simple, cost-effective method to make thin, uniform layers of these materials, which could expand capabilities for devices from solar cells to cell phones.

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

09/20/2017  Sales of ICs built using <40nm process technology forecast to rise 18% at pure-play foundries.

09/19/2017  GLOBALFOUNDRIES and Soitec today announced that they have entered into a five-year agreement to ensure the volume supply of state-of-the-art fully depleted silicon-on-insulator (FD-SOI) wafers.

09/19/2017  Semiconductor Research Corporation (SRC), today announced that Samsung Electronics Company Ltd. (Samsung), one of the world's largest chipmakers, has signed an agreement to join SRC's research consortium. Samsung will participate in two SRC platforms – the New Science Team (NST) project and the Global Research Collaboration (GRC) program.

09/18/2017  Cadence Design Systems, Inc. today announced that it has received three TSMC Partner of the Year awards at this year's TSMC Open Innovation Platform (OIP) Ecosystem Forum.

09/18/2017  GLOBALFOUNDRIES today announced the availability of a new set of enhanced RF SOI process design kits (PDKs) to help designers improve their designs of RF switches and deliver differentiated RF front-end solutions for a wide range of markets including front-end modules for mobile devices, mmWave, 5G and other high-frequency applications.

09/15/2017  Researchers and exhibitors will showcase their work during a comprehensive conference program of technical papers, panels, special sessions, short courses/tutorials, and an exhibition that will spotlight premier work in the fields of microelectronics, semiconductor packaging and circuit design.

09/15/2017  Cadence Design Systems, Inc. today announced that John Wall, corporate vice president of finance and corporate controller of Cadence, has been appointed senior vice president and chief financial officer of Cadence, effective October 1, 2017.

09/15/2017  TowerJazz, the global specialty foundry, today announced the release of its advanced 5V 65nm power process providing customers with multiple advantages over 0.18um 5V technologies.

09/14/2017  Lam Research Corp. today announced it has recognized seven companies with Supplier Excellence Awards.

09/14/2017  SPTS Technologies today announced that it has been selected by Chipmore Technology Corporation Limited.

09/14/2017  Despite a slightly down first quarter, the semiconductor industry achieved near record growth in the second quarter of 2017, posting a 6.1 percent growth from the previous quarter, according to IHS Markit.

09/13/2017  In this role, Shiode will help advance the U.S. semiconductor industry’s key legislative and regulatory priorities related to semiconductor research and technology, product security, and high-skilled immigration, among others.

09/13/2017  This is the first stage in beginning FD-SOI production in Singapore and providing multi-site FD-SOI substrate sourcing to the global semiconductor market.

09/12/2017  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$14.1 billion for the second quarter of 2017.

09/12/2017  2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion.

09/08/2017  Worldwide sales up 3 percent compared to previous month; Americas market leads the way with growth of 36 percent year-to-year and 5 percent month-to month.