10/01/1999  This invention aims at maintaining gas purity by using two cleanrooms. One cleanroom is used to store the gas supply pipe that extends from a storage tank. The other cleanroom houses gas containers that are fed by gas filling pipes. When the gas-filling pipes are not in use, ultra-high purity nitrogen gas flows, maintaining an extremely clean state inside of the pipes.
Patent number: 5,937,918
Date granted: August 17, 1999
Inventors: Mitauhide Takeharada and Shigeyoshi Nozawa, Teisan

10/01/1999  Cleanroom air filtration still has work to do in such areas as reducing outgassing, implementing new materials and lowering operating costs.

10/01/1999  A variety of technologies now exists to measure particle levels reliably in gas distribution systems with different optimal technologies for each combination of inert/reactive gas and bulk/cylinder distribution system. The proper selection of measurement hardware and sampling procedures allows for detection of particles as small as 0.003 micron.

09/01/1999  A plot published by Don Grant several years ago graphically illustrated an important filtration phenomenon. It is a plot of particle penetration through a filter vs. particle diameter, similar to the plot discussed in last month's column ("Fibrous filter performance: Particle control success; AMC failure," CleanRooms, August 1999, page 10).

08/27/1999  After several months of negotiations, Finnish wafer maker Okmetic has purchased Crysteco's epitaxial wafer plant in Allen, TX, for an undisclosed sum.

08/05/1999  With the bulk of lithography equipment users searching for effective methods to push the resolution limits of their steppers, a test reticle that implements patented phase-shift technology is making it possible to rapidly and accurately analyze focus-related anomalies, characterize system and lens performance, and extend system capabilities to enhance overall tool performance.

08/01/1999  As-electroplated copper undergoes a gradual recrystallization at room temperature related to the plating chemistry. The influence of damascene topography on the recrystallization as well as on the texture of Cu must be understood to optimize properties for superior interconnect performance. A low-temperature anneal before CMP stabilizes the Cu microstructure and eliminates the (111) sidewall growth component that is observed if the overlying Cu is removed before recrystallization.

07/01/1999  Cleanroom classifications in both Fed-Std-209E and the ISO 14644 standards are based strictly on aerosol particle concentration. Contamination not detected or counted by a particle counter makes no difference in the classification.

05/01/1999  FOUPs are allowing for a degradation of cleanrooms, because the cleanliness is where it will do the most good -- right next to the wafers

05/01/1999  With clean manufacturing becoming a preferred business practice, industry sources say laminar flow workstations are needed now more than ever.

05/01/1999  I read your article on HEPA/ULPA filter advancements and airborne molecular contamination (AMC) ("Particle Trap," CleanRooms, January 1999, page 14) and thought that I would share some of my experiences over the past 15 years in this business.

05/01/1999  FRANKLIN, MA -- A growing concern about airborne molecular contamination (AMC) in semiconductor processing has led to the development of a wafer storage environment specifically designed to filter molecular contaminates in photolithography processes.

05/01/1999  The palm-sized Thermal Track instrument enables users to conduct direct multipoint wafer temperature measurements to monitor thermal cycles in lithography, CVD, RTP and other semiconductor processes in real time. According to the manufacturer, this computer is half the size and weight of its predecessor and runs five times as long on its lithium-ion battery. New software features include a strip chart display of temperature versus time for each temperature sensor location on the wafer, and for s

04/01/1999  Model KA250, un veiled in March by Fluoroware Inc. (Chaska, MN), is a customizable 200-mm carrier for advanced wafer processing that incorporates two materials to achieve high performance at mid-range prices. Enhanced contamination control and automation compatibility are among its key characteristics.

03/01/1999  Leuven, Belgium -- The Inter uni versity Microelectronics Research Center (IMEC; Leuven, Belgium) and Semitool Inc. (Kalispell, MT) have announced a collaboration aimed at replacing conventional H2SO4/H2O2 photoresist-removal and cleaning processes used in semiconductor fabrication with lower-cost, environmentally friendly technology. The removal of H2SO4 and H2O2 from the manufacturing process promises to both reduce chemical and disposal costs as well as reduce deionized water usage. Ozonated

03/01/1999  Marblehead, MA -- Despite economic difficulties and a spotty technology base, Romanian institutes and companies are engaged in semiconductor development work, and are seeking international development partners.

02/01/1999  PRI Automation has agreed to a stock-swap takeover of Promis Systems Inc., a Toronto-based manufacturing execution systems company. The deal adds another link to PRI`s chain of fab automation products, which includes materials transport, front-end robots and planning/scheduling software. It will also add another layer of competition between PRI and tool robotics supplier Brooks Automation, which acquired MES developer FASTtech Integration last September, and create a direct rivalry with Applied

02/01/1999  GaSonics is installing its third Performance Enhancement Platform (PEP) system in the Vitesse Pierre Lamond wafer fabrication facility in Colorado Springs, CO -- a six-inch Gallium Arsenide (GaAs) fab. The PEP system features a fluorine-compatible clean chamber and a high throughput module for rapid resist removal. According to Vitesse, the system meets criteria for tool uptime and flexibility. The facility will support current generation technology and future technology development. -- TGW

12/01/1998  Daw Technologies has been awarded a $5.5 million contract to build approximately 42,000 square feet of Class 1,000 cleanroom space for a semiconductor wafer fabrication facility in Fort Collins, CO. Daw is responsible for installation and on-site project and construction management of the cleanroom area, and is furnishing critical components, including AirFrame ceilings, NetWork wall systems and Matrix aluminum access flooring systems. Completion is scheduled for July 1999. -- TGW

11/01/1998  Singapore -- Philips Electronics, the Netherlands, and foundry Taiwan Semiconductor Manufacturing Corp. are planning to build Singapore`s eleventh fab, a $1.2 billion joint venture facility targeted to begin production in the second half of 2000.