Wafer Processing

WAFER PROCESSING ARTICLES



Wafer surface particle measuring system

09/01/1996  The Wafer Surface Particle Measuring System (WM-3) from Topcon Technologies, Inc. detects particles on a wafer surface and transfers data to a host computer for expanded analysis. The WM-3`s mean-time-between failures exceeds 10,000 hours and the product offers particle size classification up to 60 precalibrated size settings with numerical and defect map display. It uses the scattered laser light detection method and has a footprint of 3 ft2. Key applications include: process, equipment and cle

New Particle Removal System Patent Allowed

08/01/1996  Mountain View, CA--On June 26, YieldUP International Corporation announced the U.S. Patent Office has allowed a patent for its CleanPOINT particle removal system, a water filtration method based on the principle of electrostatic attraction. Using electrostatically charged filters, the point-of-use water cleaning technology removes microscopic particles down to less than 0.1 µm. YieldUP, founded in 1993, develops, manufactures and markets wafer cleaning, rinsing and drying equipment for the s

New Wafer Cleaning Technology Uses Frozen Gas Crystals

07/01/1996  Minneapolis, MN--A new technology for removing particulate and etch residue contamination on semiconductor wafers uses frozen argon/nitrogen gas crystals to clean 0.35-micron applications. FSI International, Inc. introduced the Aries Cryogenic Aerosol Cleaning System this month. Says Dan Syverson, technical marketing manager at FSI International: "The semiconductor manufacturing industry needs practical process equipment that reduces or eliminates chemical usage. The Aries tool meets this need a

Article sparks business

07/01/1996  As subscribers to CleanRooms, we would like to thank you very much for your enlightening special report on cleanroom laundries ("How to choose a cleanroom laundry," Jan. 1996, p. 12). In addition to general cleanroom laundry concepts, the article has proven to be a significant source of technology trends and a guide to key persons active in this area.

Automation Reduces Contamination and Costs within Semiconductor Fab Cleanrooms

07/01/1996  To reduce the potential for contamination and human error, automated material handling systems assume the roles of machine operator, inventory manager and stock person.

New Wafer Cleaning Method Eliminates Water/Chemical Requirements

01/01/1996  Bethesda, MD--Industry Week magazine has chosen as a finalist for its "Technology of the Year" award, Radiance Services Co., marketer of the Radiance Process, an internationally patented new way of cleaning contamination from wafer surfaces, based on an application of quantum physics, using a pulsed laser and a flowing inert gas such as argon or nitrogen.

Mobile Microenvironment

07/01/1995  Servicor, Inc. introduces what it touts as the industry`s first mobile microenvironment cleanroom. Completely portable on "easy glide" wheels, the ServicartTM is designed to meet the needs of manufacturers in the semiconductor, wafer fab, medical device, biotechnology, pharmaceutical, printed circuit board, and other industries. The Servicart includes its own 110 Vac electric power plant and a three-stage filtered air supply system for primary use in the storage and transfer of products normally

Solvent stripping stations

06/01/1995  JST Custom Fabrication`s Series 200A semi-automated solvent stripping stations feature a flexible design that conforms to a wide range of stripping requirements. An ergonomic, stainless steel shell is available as a front or rear access design. The station plenum houses the process baths and plumbing components, while providing secondary fluid containment. Solvent drains are plumbed to the rear of the station for connection into facility plumbing or remote carboy containers. Process baths are co

Alliance Pushes 300-mm Wafer Production

05/01/1995  Geneva, Switzerland--The rapidly changing needs of the semiconductor industry have prompted three organizations to form a technical consortium, the focus of which is the advancement of "large" silicon wafer production processes. On April 4, Jenoptik (Jena, Germany), Meissner & Wurst (Stuttgart, Germany), and Empak (Chanhassen, MN) jointly announced the formation of a "strategic alliance" aimed at tackling the challenges of 300-mm semiconductor wafer manufacture. The new company will be called IN

Residual gas analyzers

05/01/1995  The NGS Division of MKS Instruments, Inc. makes the PPT Series of Residual Gas Analyzers (RGAs) for use in semiconductor manufacturing. Designed for use at pressures below 1 ¥ 10-4 Torr, the standalone NGS RGA`s perform process monitoring, leak detection, contamination detection, as well as background analysis of a variety of semiconductor processes.

Wafer transport carts

04/01/1995  Poly Design, Inc. is introducing a line of wafer transport carts that are constructed of 1/2 and 3/8-in. thick white polypropylene with 3/8-in. clear acrylic doors. The doors are fully gasketed, have lift-and-pull handles and are mounted with stainless piano hinge.

Particle contamination control system

04/01/1995  HIAC/ROYCO, a division of Pacific Scientific Company, introduces the In- Situ Chemical Particle Monitoring System, developed exclusively for critical wet-etching and wafer cleaning processes. It is the first compact particle-monitoring system for continuously measuring particles at various points within automated wet process stations. Particle levels as small as 0.1 microns can be measured in wafer baths of any semiconductor process chemicals and cleaning solutions. Included in the system is the

3-D Design Tool Aids Motorola MOS 5 Expansion

02/01/1995  Mesa, AZ--Motorola has recently completed construction of a new Class 1000 Wafer, Test and Probe facility at its MOS 5 facility (Mesa, AZ) and has begun expansion and renovation of an existing fab building to meet Class 100 or better standards. Faced with the need to expand its wafer fabrication capacity, but hindered by real-estate limitations at the Mesa site, the company decided to make maximum use of its existing infrastructure investment.

Jenoptik Acquires Meissner & Wurst

02/01/1995  Herrenberg, Germany--The Jenoptik Group (Herrenberg, Germany) an international manufacturer of wafer equipment, marketing primarily to the Eastern Bloc, recently announced its acquisition of privately-held Meissner & Wurst GmbH & Co. (Stuttgart, Germany). M&W is considered a leader in cleanroom design, installation, and contamination control and is involved in a broad range of wafer handling, cleanroom, and isolation technologies, as well as the emerging field of mini-environments.

Architectural and project management firm

01/01/1995  AMPI is an Architectural and Project Management Firm specializing in the electronics industry, from front end crystal growing, through wafer fabrication to final assembly.

Maintaining Gas Purity--A Systems Approach to Contamination Control

01/01/1995  Controlling particles is not enough to guarantee contamination-free manufacturing. Gas purity must be maintained from production to wafer processing.

Perfluoroelastomer compounds

01/01/1995  A series of perfluoroelastomer compounds has been developed by Greene, Tweed & Co. to meet semiconductor manufacturing process environments. Seals of Chemraz AquaPro have been developed for critical sealing areas in wet chemistry processing and photolithography. Seals of Chemraz PlasmaPro have been developed for critical sealing applications in etch, CVD and diffusion processes.

45,000 square ft. Class 10 Cleanroom for Sale or Lease

01/01/1995  Lee`s Summit, MO--AT&T has put its entire 1.3 million ft.2 Kansas City Works plant (Lee`s Summit, MO), including 45,000 ft.2 of Class 10 cleanroom, on the block for $45 million. The cleanroom space, located in the complex`s 557,000 ft.2. "Building 30" was designed for VLSI wafer fabrication of NMOS or CMOS ICs. In order to use the Class 10 and other clean rooms totalling 144,000 ft.2, it would be necessary to have control of all of building 30, including its basement, waste treatment facility, g




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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