Wafer Processing

WAFER PROCESSING ARTICLES



Semiconductor content in electronic systems forecast to set new record in 2017

07/14/2017  Semiconductor content expected to reach 28.1% this year, breaking previous high of 25.9% set in 2010.

ASM International launches Intrepid epitaxy tool

07/13/2017  ASM International introduced the Intrepid ES 300mm epitaxy (epi) tool for advanced-node CMOS logic and memory high-volume production applications.

Industry acting to reduce greenhouse gases

07/13/2017  Semiconductor manufacturers use a variety of high global warming potential (GWP) gases to process wafers and to rapidly clean chemical vapor deposition (CVD) tool chambers.

Bridging the macro and micro world of defects

07/12/2017  When it comes to defects and contamination in the semiconductor manufacturing industry, most people tend to think of small, sub-nm defects at the transistor level. As important as those are, there are plenty of things that can go wrong and be seen at the macro level.

$49.4B semiconductor equipment forecast: New record, Korea at top

07/12/2017  Worldwide sales of new semiconductor manufacturing equipment are projected to increase 19.8 percent to total $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000.

Thinking thin brings new layering and thermal abilities to the semiconductor industry

07/11/2017  In a breakthrough for the semiconductor industry, researchers demonstrate a new layer transfer technique called "controlled spalling" that creates many thin layers from a single gallium nitride wafer.

Latest outlook for industrial semiconductor growth

06/29/2017  Worldwide industrial semiconductor revenues grew by 3.8 percent year-over-year in 2016, to $43.5 billion, according to the latest analysis from business information provider IHS Markit.

Taiwan Compound Semiconductor Seminar ? Envisioning next-gen communications

06/29/2017  Market demand is driving development of 5G network standards, and commercial applications are expected to be introduced by 2020.

New Taiwan Automation Technology TC chapter

06/29/2017  At its recent Spring 2017 meeting, the North American Regional Standards Committee (NARSC) approved formation of a Taiwan chapter of the global SEMI Standards Automation Technology Committee.

Micron and SEMI partner to host High Tech U in Silicon Valley

06/28/2017  The SEMI Foundation and the Micron Technology Foundation announced their partnership this week to deliver the 213th SEMI High Tech U (HTU) program which kicks off in earnest today at Micron’s facilities in Milpitas.

SEMI and Solid State Technology announce 2017 “Best of West” Award finalists

06/28/2017  Each year at SEMICON West, the “Best of West” awards are presented by Solid State Technology and SEMI.

It’s time for new innovation

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

How SEMI Standard E175 is saving energy and cutting costs

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

Cellphone IC sales will top total personal computing in 2017

06/20/2017  Higher memory prices accelerate sales growth in both cellphones and personal computing systems but cellular handsets will become the largest application for ICs this year.

Alloying materials of different structures offers new tool for controlling properties

06/19/2017  New research into the largely unstudied area of heterostructural alloys could lead to greater materials control and in turn better semiconductors, advances in nanotechnology for pharmaceuticals and improved metallic glasses for industrial applications.

North American semiconductor equipment industry posts May 2017 billings

06/16/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in May 2017 (three-month average basis)

UMC restructures executive team

06/15/2017  UMC today announced that its board of directors has appointed senior vice presidents SC Chien and Jason Wang as co-presidents of the company, following Po-Wen Yen’s retirement as UMC CEO.

GLOBALFOUNDRIES on track to deliver Leading-Performance 7nm FinFET technology

06/14/2017  GLOBALFOUNDRIES this week announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost.

Imec world-first to develop 200V, 650V dispersion free normally-off/e-mode power devices on 200mm/8-inch Si wafers

06/13/2017  Imec announced today that it has developed 200V and 650V normally-off/enhancement mode (e-mode) on 200mm/8-inch GaN-on-Silicon wafers.

NREL-led research effort creates new alloys, phase diagram

06/13/2017  A multi-institutional team led by the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) discovered a way to create new alloys that could form the basis of next-generation semiconductors.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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