03/02/2017  Three of the top 11 companies are expected to increase capex spending by 25% or more.

02/27/2017  Renesas Electronics Corporation and Intersil Corporation announced the completion of Renesas' acquisition of Intersil Corporation.

02/27/2017  At the SPIE Advanced Lithography conference in San Jose, Calif. (USA), imec and its partners will present a patterning solution for a 42nm-pitch M1 layer and a 32nm-pitch M2 layer in logic design compatible with the foundry N5 requirements.

02/23/2017  South Korea narrows gap with Taiwan; China shows biggest increase, accounts for nearly 11%.

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

02/22/2017  North America-based manufacturers of semiconductor equipment posted $1.86 billion in billings worldwide in January 2017 (three-month average basis).

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

02/21/2017  Mohamed Saleem has joined Brooks Instrument as the company's new chief technology officer (CTO), where he will oversee its California-based technology development center.

02/20/2017  EUV, cobalt contacts, are expected to be introduced at the 7nm node by several semiconductor manufacturers.

02/17/2017  The explosive growth in demand for internet bandwidth and cloud computing capacity brings a new set of technology challenges and opportunities for the semiconductor supply chain.

02/16/2017  Among Top-10 R&D spenders, Intel accounted for 36% of R&D outlays.

02/13/2017  The company will continue investing in its wafer plants in the United States and Germany, expand its capacity in Singapore, and construct a facility to produce 12-inch wafers in Chengdu, China in order to satisfy Chinese and global demands for the company's 22FDX technology.

02/10/2017  Applied Materials, Inc. announced today that Dr. Om Nalamasu, Senior Vice President and Chief Technology Officer, has been elected to the U.S. National Academy of Engineering (NAE), one of the highest professional honors for engineers.

02/10/2017  The company is investing in its existing leading-edge fabs in the United States and Germany, expanding its footprint in China with a fab in Chengdu, and adding capacity for mainstream technologies in Singapore.

02/09/2017  Grant A. Pierce, chief executive officer (CEO) of Sonics, Inc. was elected by the Board of Directors of the Electronic System Design Alliance (ESD Alliance) to serve as its chairman.

02/09/2017  Toshiba Corporation today announced that it has started construction of a new semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base.

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

02/09/2017  Significant and noticeable IC market growth closely tied to significant worldwide GDP growth.

02/08/2017  SEMICON Korea 2017, opening today at COEX in Seoul, celebrates its 30th anniversary with its largest-ever exhibition.

02/07/2017  New media provides yield improvements in systems for advanced semiconductor and LED applications.