Wafer Processing

WAFER PROCESSING ARTICLES



SEMI adds industry veteran to Americas leadership

11/30/2016  David Anderson joins as SEMI Americas President.

IoT and automotive to drive IC market growth through 2020

11/30/2016  New report also projects good IC sales increases in medical electronics, digital TVs, and servers.

SiFive launches industry's first open-source RISC-V SoC

11/29/2016  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced the availability of its Freedom Everywhere 310 (FE310) system on a chip (SoC).

North American semiconductor equipment industry posts October 2016 book-to-bill ratio of 0.91

11/28/2016  The book-to bill ratio for October dropped below parity for the first time in 11 months, even though bookings and billings activity remains at elevated levels relative to last year.

Microsemi to offer FPGA-based RISC-V IP core

11/21/2016  Microsemi Corporation (Nasdaq: MSCC) announced it is the first field programmable gate array (FPGA) provider to offer a comprehensive software tool chain and intellectual property (IP) core for RISC-V designs.

Executives to get strategic perspectives for success at SEMI ISS 2017

11/17/2016  Electronics manufacturing executives will examine growth prospects, global industry developments and technology strategy at the SEMI Industry Strategy Symposium (ISS) 2017 to be held January 8-11 at the Ritz-Carlton, Half Moon Bay.

Qualcomm, Samsung collaborate on 10nm process tech for the latest Snapdragon 835 mobile processor

11/17/2016  Qualcomm Incorporated today announced that its subsidiary, Qualcomm Technologies, Inc., and Samsung Electronics Co., Ltd., have extended their decade-long strategic foundry collaboration to manufacture Qualcomm Technologies' latest Snapdragon premium processor, Qualcomm Snapdragon 835, with Samsung's 10nm FinFET process technology.

UMC holds grand opening ceremony for new 12-inch wafer fab in China

11/16/2016  The fab, which was completed in record time, realized volume production for customer products merely 20 months after groundbreaking in March of 2015.

Siemens announces plans to acquire Mentor Graphics in $4.5B deal

11/14/2016  Siemens and Mentor Graphics today announced that they have entered into a merger agreement under which Siemens will acquire Mentor for an enterprise value of $4.5 billion.

Smartphone unit shipments forecast to grow at single-digit rates through 2020

11/09/2016  IC Market Drivers 2017 analyzes end-use applications and impact on IC market growth.

Third quarter 2016 silicon wafer shipments set a new record

11/09/2016  Worldwide silicon wafer area shipments increased during the third quarter 2016 when compared to second quarter 2016 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

New record for silicon-based multi-junction solar cell

11/09/2016  Researchers at the Fraunhofer Institute for Solar Energy Systems ISE together with the Austrian company EV Group (EVG) have successfully manufactured a silicon-based multi-junction solar cell with two contacts and an efficiency exceeding the theoretical limit of silicon solar cells.

The silicon photonics industry is ready for take-off

11/08/2016  Silicon photonic technologies have reached the tipping point that precedes massive growth.

President’s Council launches semiconductor working group

11/08/2016  Tthe President’s Council of Advisors on Science and Technology (PCAST) announced the formation of a new working group focused on strengthening the U.S. semiconductor industry in ways that benefit the nation’s economic and security interests.

SunEdison Semiconductor announces regulatory approvals from Taiwan and Austria for proposed acquisition

11/07/2016  SunEdison Semiconductor Limited announced today that it has received notice that the Investment Committee of the Ministry of the Economic Affairs of the Republic of China has approved the proposed acquisition of SunEdison Semiconductor by GlobalWafers Co., Ltd.

Astronics Test Systems announces new semiconductor system-level test platform

11/07/2016  Astronics Corporation (NASDAQ:ATRO), through its wholly-owned subsidiary Astronics Test Systems, introduced its new breakthrough System-Level Test (SLT) platform that is expected to revolutionize the testing of high volume integrated semiconductor devices.

SMIC Shenzhen launches construction of the first 12-in IC production line in South China

11/04/2016  Semiconductor Manufacturing International Corporation announces the official launch of a 12-inch integrated circuit (IC) production line at SMIC's Shenzhen facility. It will be the very first 12-inch fab in South China.

Samsung expands its advanced foundry offerings with 14LPU and 10LPU processes

11/03/2016  The new foundry process offerings as well as EUV-enabled 7nm wafer are presented at the Samsung Foundry Forum.

2016 Global Semiconductor Alliance Award nominees announced

11/03/2016  The Global Semiconductor Alliance (GSA) announced the 2016 award nominees for the GSA Awards Dinner Celebration.

Qualcomm/NXP deal underscores semiconductor merger trend

11/02/2016  Qualcomm's proposed acquisition of NXP Semiconductors marks the latest deal in a wave of industry consolidation that includes increasingly expensive transactions with greater focus on expanding scope rather than economies of scale.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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